Production process of high-order high-density HDI printed circuit board
A printed circuit board, high-order high-density technology, applied in the direction of drying of printed circuits, secondary processing of printed circuits, cleaning/polishing of conductive patterns, etc. High drying efficiency, high drying quality, and the effect of improving production efficiency
Inactive Publication Date: 2018-11-30
SICHUAN HAIYING ELECTRONICS TECH
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AI Technical Summary
Problems solved by technology
[0003] However, during the baking process in the oven, a large number of water droplets are attached to the surface of the circuit board. During the drying process, it takes a long time to evaporate the water droplets, which reduces the drying efficiency.
In addition, water marks remain on the surface of the circuit board after drying, which is very unsightly and reduces the appearance quality of the circuit board
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0020] The present invention will be further described below, and the protection scope of the present invention is not limited to the following:
[0021] A high-end high-density HDI printed circuit board production process, which includes the following steps:
[0022] S1. Cutting: Cut the raw materials into small plates according to the size of the product drawings, and use an edge grinding machine to remove the burrs and edges of the plate edges after cutting;
[0023] S2, inner layer wiring: specifically including the following steps:
[0024] S21. Press dry film: press a layer of photosensitive dry film on the brushed clean surface;
[0025] S22. Alignment exposure: align the upper and lower layers of the brown sheet to be exposed, and transfer the inner layer circuit pattern required by the customer to the board through the exposure machine;
[0026] S23. Developing: removing the dry film of the photosensitive part of the board surface to obtain a circuit pattern;
[0027] S24. Etchin...
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The invention discloses a production process of a high-order high-density HDI printed circuit board. The production process comprises the following steps that S1, material cutting is conducted, specifically, a raw material is cut to be in the small board size according to the size of a product drawing, and burrs and flashing at the board edges after material cutting are removed through an edge grinding machine; S2, inner layer wiring is conducted and specifically comprises the following step that S21, a dry film is pressed, specifically, the layer of sensitive dry film is pressed on the cleanground and brushed board surface; and S3, laminating is conducted, specifically, different models of PP glue pieces are pasted to the two surfaces of an inner layer board according to the production and manufacturing indications, and after laminating, the inner layer and the outer layer are closely bonded and insulated. The production process of the high-order high-density HDI printed circuit board has the beneficial effects that the drying efficiency is high, the drying quality is high, and the production efficiency of the printed circuit board is improved.
Description
Technical field [0001] The invention relates to a production process of a high-order and high-density HDI printed circuit board. Background technique [0002] At present, the design and connection of all electronic instrument circuits are mostly based on printed circuit boards. With the advancement of science and technology in the electronics industry, in order to better meet the needs of miniaturization of electronic equipment, the number of layers of flexible circuit boards is increasing. Printed boards are developing in the direction of multilayer and dense. After the high-end high-density printed circuit board is made, the oil stains on its end surface need to be cleaned to make the surface smooth. The existing cleaning process is as follows: first place the circuit board in a sink filled with cleaning fluid, the worker shakes the circuit board in the sink, the cleaning fluid cleans off the oil on the end surface of the circuit board, and after cleaning, the circuit board is...
Claims
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IPC IPC(8): H05K3/22H05K3/26
CPCH05K3/227H05K3/26
Inventor 陶应国石学全卢小燕
Owner SICHUAN HAIYING ELECTRONICS TECH