An integrated refrigeration device

Abstract

The invention discloses an integrated refrigeration device comprising an integrated body. The sidewall of the integrated body is provided with a high-pressure inlet and a low-pressure outlet, and a one-way working medium flow path having a throttle section and an evaporation section is arranged in the integrated body. One end of the working medium flow path is the high-pressure inlet and the otherend of the working medium flow path is the low-pressure outlet. The evaporation section is arranged to be adjacent to one side of the integrated body, and the side forms an evaporator of the refrigerator. The outstanding advantages of the integrated refrigeration device are that the device is closer to a cooling target in terms of size, higher in integration degree, correspondingly lower in radiation and heat leakage, and can realize integral molding.

Description

technical field [0001] The invention belongs to the technical field of low-temperature refrigeration, and in particular relates to an integrated refrigeration device. Background technique [0002] In recent years, with the rapid development of miniature low-temperature electronic devices and low-temperature nanotechnology, there is a major demand for low-temperature refrigeration technology to be miniaturized and highly integrated. However, the existing mature cryogenic refrigeration systems are relatively bulky, which leads to many problems such as complex operation, low efficiency, high price or operating cost. [0003] The JT refrigerator has no moving parts at the cold end, and has the advantages of simple structure, low interference noise, and fast cooling speed. Its volume can be less than one tenth of that of a Stirling refrigerator, and its cooling efficiency at low temperatures can reach that of a thermoelectric refrigerator. At present, it is the only liquid nitro...

AI Technical Summary

Problems solved by technology

Although the appearance and size of the chip-level JT refrigerator with planar flow channel is relatively close to the application requirements such as micro-cryogenic chips, there are still problems such as the overall length is much larger than the length of the evaporator, the integrated system is not compact enough, and the radiation heat leakage is large.

Moreover, the processing method based on photolithography is essentially a planar processing technology, which cannot guarantee high-precision processing of complex three-dimensional channel structures, which limits the further miniaturization of chip-level JT refrigerators.

[0006] Generally speaking, the existing flow channel structure is not compact enough. For the cooling target, only the evaporator is in direct contact with it among the components of the JT refrigerator

However, in order to achieve sufficient heat exchange and reduce axial heat conduction, the partition wall heat exchanger requires a longer flow channel, which occupies a much larger area than the evaporator in chip-level JT refrigerators with capillary flow channels and planar flow channels. Space or area, so that the refrigerator cannot meet the needs of high integration with the current application

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