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Wafer level packaging method, laser module, camera assembly and electronic device

A technology of wafer-level packaging and lasers, which is applied to laser components, lasers, semiconductor lasers, etc., can solve problems such as low efficiency, and achieve the effect of improving packaging efficiency and production efficiency

Active Publication Date: 2020-04-14
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In related technologies, the packaging method of Vcsel laser modules requires individual packaging, and the efficiency is relatively low.

Method used

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  • Wafer level packaging method, laser module, camera assembly and electronic device
  • Wafer level packaging method, laser module, camera assembly and electronic device
  • Wafer level packaging method, laser module, camera assembly and electronic device

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Embodiment Construction

[0048] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application.

[0049] Refer below Figure 1-Figure 6 A wafer-level packaging method for a laser module according to an embodiment of the present application is described. Wherein, the laser module 4 may be a Vcsel (Vertical Cavity Surface Emitting Laser, vertical cavity surface emitting laser) laser module.

[0050] Such as Figure 1-Figure 6 As shown, the wafer-level packaging method for laser modules according to the embodiment of the first aspect of the present application includes the following steps:

[0051] S1. Provide a wafer 50...

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Abstract

The invention discloses a method for wafer level packaging, a laser module, a camera assembly and an electronic device. The wafer-level packaging method for a laser module comprises the following steps: S1, providing a wafer, a packaging bracket and a lens layer, wherein the wafer comprises a substrate and a plurality of laser chips arranged on the substrate in an array, each laser chip is flippedon the substrate; 2, sequentially stacking that wafer, the encapsulation bracket and the lens layer and bonding and fixing the wafer by glue to form a wafer-level encapsulation part; S3, cutting thewafer-level package to obtain a single laser module. According to a wafer-level packaging method for a laser module according to an embodiment of the present application, a laser chip of a wafer is flip-chip-mounted on a substrate, the wafer, the packaging bracket and the lens layer are packaged integrally, and after packaging, the laser module is cut into individual laser modules, thereby improving the packaging efficiency of the laser module.

Description

technical field [0001] The present application relates to the field of electronic devices and their manufacture, in particular to a wafer-level packaging method, a laser module, a camera assembly and an electronic device. Background technique [0002] In the related art, the packaging method of the Vcsel laser module needs to be packaged individually, and the efficiency is relatively low. Contents of the invention [0003] This application aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present application is to propose a wafer-level packaging method for a laser module, which can improve the packaging efficiency of the laser module. [0004] The present application also proposes a laser module manufactured by the above-mentioned wafer-level packaging method. [0005] The present application also proposes a camera assembly having the above-mentioned laser module. [0006] The present application also proposes an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/022
CPCH01S5/02326H01S5/0236
Inventor 杨鑫
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD