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Surface acoustic wave device and manufacturing method thereof

A technology of a surface acoustic wave device and a manufacturing method, applied in the field of wireless communication, can solve problems such as limited adjustment range, and achieve the effect of reducing cost

Active Publication Date: 2022-06-24
EPIC MEMS XIAMEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] (2) Although the resonant frequency (fs) and electromechanical coupling coefficient (k2eff) of the surface acoustic wave device can be adjusted by changing the IDT thickness and duty cycle of the resonator, the adjustment range is limited

Method used

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  • Surface acoustic wave device and manufacturing method thereof
  • Surface acoustic wave device and manufacturing method thereof
  • Surface acoustic wave device and manufacturing method thereof

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Embodiment Construction

[0039] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure will be further described in detail below with reference to the specific embodiments and the accompanying drawings.

[0040] The SAW device of the present disclosure uses an IDT to convert electrical energy to acoustic energy, or vice versa. IDT uses a piezoelectric substrate and two opposing busbars at two different potentials and two sets of electrodes connected to the two busbars. The electric field between two consecutive electrodes at different potentials provides the sound source due to the inverse piezoelectric effect. Conversely, if the transducer receives an incident wave, a charge is generated in the electrodes due to the piezoelectric effect. like figure 1 As shown, a resonator is obtained by placing an interdigital transducer 1 between two reflection gratings 4, a filter or by connecting several resonators or by havi...

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Abstract

The present disclosure provides a surface acoustic wave device and a manufacturing method thereof; wherein, the surface acoustic wave device includes: a piezoelectric substrate having a plurality of different Euler cut angles; and one or more interdigital transducers An IDT is formed on the surface of the piezoelectric substrate for exciting a surface acoustic wave formed on the piezoelectric substrate. In the present disclosure, a plurality of different Euler cut angles are formed on the same substrate, thereby meeting the requirements of filters with different frequency bands and different bandwidths, and effectively reducing costs.

Description

technical field [0001] The present disclosure belongs to the technical field of wireless communication, and more particularly relates to a surface acoustic wave device with multiple Euler cut angle piezoelectric substrates and a manufacturing method thereof. Background technique [0002] SAW filters can be used in high frequency circuits, such as bandpass filters. SAW filters include piezoelectric materials and electrode structures. These electrodes can convert high-frequency signals into sound waves that propagate along the surface of the piezoelectric material. In addition, the electrode structure may also be arranged to convert the acoustic waves back to high frequency signals, thereby selectively extracting desired frequency bands. [0003] However, the existing SAW filters still have the following defects: [0004] (1) Existing surface acoustic wave device substrates are generally obtained directly from wafer manufacturers, and each wafer corresponds to one Euler cut...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/02H01L41/18H01L41/09
CPCH03H9/02559H03H9/02614H10N30/20H10N30/85
Inventor 彭波华李平胡念楚贾斌
Owner EPIC MEMS XIAMEN CO LTD