A flexible soft plate and an assembly system thereof

Abstract

The invention relates to a flexible soft plate and an assembly system thereof, comprising a flexible soft plate body, wherein the flexible soft plate body adopts a double-panel structure; A main via region and a standard pad region are arranged on the front face of the flexible soft board body, a group of electrical networks is arranged in the main via region corresponding to the electrical networks of optical device pins to be manufactured or tested, and a group of electrical networks corresponding to the main via pads is arranged in the standard pad region. A test pad area is arranged on theback surface of the flexible soft board body, and a group of test pads corresponding to the standard pad electrical network are arranged in the test pad area. A reinforcing plate is removably securedin the test pad area. The invention has the advantages that the double panel structure is adopted, the space is fully utilized, the test pad area is arranged on the back side, the reliability and theyield of the flexible soft board body test are not required to be met under the condition of expanding the non-standard pad area, and the test standard of the industry can be met.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a flexible soft board and an assembly system thereof. Background technique [0002] In modern communications, low power consumption, high density, and integration have become the development trend of optoelectronic devices and even communication modules. In the case of limited space and volume, flexible boards can be bent and folded freely, and can be freely arranged and arranged according to layout requirements. Stretchable and has good heat dissipation characteristics, the use of flexible boards in communication modules can effectively achieve dense assembly and connection of modules. [0003] However, the existing flexible board and its assembly have the following problems: [0004] With the development trend of high integration of optoelectronic devices and communication modules, the size stipulated by industry standards is getting smaller and smaller, the size...

AI Technical Summary

Problems solved by technology

[0004] With the development trend of high integration of optoelectronic devices and communication modules, the size stipulated by industry standards is getting smaller and smaller, the size of flexible boards is also getting smaller and smaller, and the pads are getting denser; and in order to obtain higher density performance and electromagnetic shielding performance, single-layer boards are gradually developing into multi-layer boards. In this way, in the process of manufacturing and testing optoelectronic devices and modules, due to the dense pads of flexible boards, it is inevitable that flexible boards and test circuits will appear. If the pad connection of the board is poorly connected or even misplaced and press-fitted, once the power is supplied, there is a high probability that it will damage the optoelectronic device and module being manufactured or tested; and because the flexibility of the multilayer board is much lower than that of the single In the multi-process production and testing of modules, repeated positioning and assembly will cause damage to the flexible board, which not only affects the appearance, but also affects the performance. As a result, products using flexible boards must be replaced with new flexible boards at high temperatures before they are sold. In the process, it is easy to cause damage to the product again and cause failure. Due to the above defects in the flexible board with high-density pads and its press-fitting method, the optoelectronic devices and communication modules are damaged or invalid during the manufacturing and testing process, and the defect rate increases. high

Images