The first bonding element and bonding device

A component and lamination technology, applied in the field of the first lamination component and lamination device, can solve the problems of low lamination efficiency and the like

Active Publication Date: 2021-08-03
INTERFACE TECH CHENGDU CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a first bonding element and a bonding device for the problem of low bonding efficiency

Method used

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  • The first bonding element and bonding device
  • The first bonding element and bonding device
  • The first bonding element and bonding device

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Embodiment Construction

[0027] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0028] Details figure 1 , a bonding device 50 provided by an embodiment of the present invention, the bonding device 50 includes a first bonding element 10, a second bonding element 20 and an annular rubber ring 30, the annular rubber ring 30 is arranged on the first bonding Between ...

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Abstract

The invention relates to a first bonding element and a bonding device. The above-mentioned first bonding element is used for heat bonding with the second bonding element through an annular rubber ring to form a closed space between the first bonding element and the second bonding element, and the first bonding element includes: The fitting body is provided with a through hole, and the through hole runs through the fitting body in the direction from the first fitting element to the second fitting element, so that the two ends of the through hole communicate with the closed space and the outside world respectively; and the through hole is movable and closed When the air pressure in the closed space is greater than the external air pressure, the closed space communicates with the outside through the through hole to realize pressure relief; when the air pressure in the closed space is less than or equal to the external air pressure, the pressure relief mechanism closes the through hole. The above-mentioned first bonding element and bonding device, when the first bonding element and the second bonding element are thermally bonded through the annular rubber ring, the air pressure in the closed space can be adjusted through the pressure relief mechanism to prevent the air in the closed space from Thermal expansion causes deformation of the uncured annular rubber ring.

Description

technical field [0001] The invention relates to the field of product assembly, in particular to a first bonding element and a bonding device. Background technique [0002] In the field of product assembly, it is usually necessary to use dispensing to make the two components stick together. After the glue is cured, the fixed connection of the two components is realized. The specific process is as follows: First, glue is dispensed on one component to form an annular rubber ring; then another component is attached to the annular rubber ring; then the two components and the annular rubber ring sandwiched between the two components are heated; After the rubber ring has cured, the two components are firmly connected together. Since the annular rubber ring is closed and has a certain thickness, after another component is pasted on the annular rubber ring, a closed space with air will be formed between the two components, and during the heating process, the air in the closed space ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13G09F9/30
CPCG02F1/1303G09F9/30
Inventor 涂晋益
Owner INTERFACE TECH CHENGDU CO LTD
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