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A chip dustproof structure and computing equipment, mining machine

A dust-proof structure and chip technology, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of deposition, failure, chip performance degradation, etc., to enhance heat dissipation effect, enhance strength, prevent heat Overpressure effect

Active Publication Date: 2020-09-04
BEIJING BITMAIN TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If used in such an environment for a long time, such as figure 1 As shown, the chip of the mining machine will easily enter the dust and deposit on the pins of the chip, which will cause the performance of the chip to decline or even fail

Method used

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  • A chip dustproof structure and computing equipment, mining machine
  • A chip dustproof structure and computing equipment, mining machine
  • A chip dustproof structure and computing equipment, mining machine

Examples

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] The principle and spirit of the present invention will be explained in detail below with reference to several representative embodiments of the present invention.

[0028] The chip dust-proof structure of the embodiment of the present invention is mainly to add a circle of pads around the computing chip area and / or storage chip area in the mining machine, and then weld a metal shield with good thermal conductivity on the pad. The gap between the cover a...

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PUM

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Abstract

The embodiment of the invention relates to the field of chip dustproof, and provides a chip dustproof structure, a computing device and a mining machine. Wherein the chip dust-proof structure is arranged between the chip and the heat sink and comprises a bonding pad and a metal shield layer; Wherein the bonding pad is bonded around the chip, the metal shielding layer is bonded through the bondingpad and covered on the chip, and the metal shielding layer is connected with the heat sink; A thermal interface material having a high thermal conductivity is filled between the metal shield layer andthe chip. As that metal shield layer is arrange between the chip and the heat sink, the invention protects the chip from bad phenomena caused by dust entering into the pin, and can enhance the strength of the chip area and avoid the influence of vibration. Moreover, since the through holes are provided at the four top corners of the top plate of the metal shield layer, excessive hot pressure in the metal shield layer is prevented, and a thermal interface material is filled between the top plate and the heat sink, the heat dissipation effect can be enhanced.

Description

technical field [0001] The invention relates to the field of chip dustproofing, in particular to a chip dustproofing structure, computing equipment, and a mining machine. Background technique [0002] At present, the construction environment of the mining machine is generally in a sparsely populated, dusty and desolate place. If used in such an environment for a long time, such as figure 1 As shown, the chip of the mining machine will easily enter the dust and deposit on the pins of the chip, which will cause the performance of the chip to decline or even fail. [0003] It should be noted that the above introduction of the technical background is only for the convenience of a clear and complete description of the technical solution of the present invention, and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are known to those skilled in the art just because these solutions are described in the ba...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/00H01L23/373H01L23/427H01L23/467
CPCH01L23/3737H01L23/427H01L23/467H01L23/564H01L2224/73253
Inventor 翟凯乐韩大峰
Owner BEIJING BITMAIN TECH LTD
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