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A Preprocessing Method Before Optical Proximity Correction

A technology of optical proximity correction and preprocessing, which is applied in the photo-engraving process of originals, optics, and pattern surfaces for opto-mechanical processing, etc., to achieve the effect of removing the factors of optical proximity correction.

Active Publication Date: 2022-05-27
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

Since the conventional graphic side is orthogonal to the coordinate axis, the above method can effectively deal with the graphic protrusion or the graphic gap. However, for the graphic protrusion or graphic gap on the hypotenuse, it is impossible to directly form the graphic filling area including the short side and its adjacent side. , so the above method cannot be used to deal with

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  • A Preprocessing Method Before Optical Proximity Correction
  • A Preprocessing Method Before Optical Proximity Correction
  • A Preprocessing Method Before Optical Proximity Correction

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Embodiment Construction

[0023] It should be noted that, in the case of no conflict, the following technical solutions and technical features can be combined with each other.

[0024] The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings:

[0025] like Figure 1-5 As shown, a preprocessing method before optical proximity correction is used to preprocess an original target graphic before performing optical proximity correction, so as to remove the graphic gap on the hypotenuse of the original target graphic to obtain the processed target graphic, The original target graphic is composed of a hypotenuse and a plurality of right-angled sides 1, and the graphic notch is composed of a first short side 2, a second short side 3 located obliquely below the first short side 2, and a second short side 3 sandwiched between the first short side 2. A third adjacent side 6 between a short side 2 and the second short side 3 is formed, and the ...

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Abstract

The invention provides a preprocessing method before optical proximity correction, which belongs to the technical field of microelectronics optical proximity correction, comprising: inputting the original target figure into the preprocessing software; expanding the first short side and the first adjacent side to form the second A rectangle, expand the second short side and the second adjacent side to form the second rectangle in the orthogonal direction; select the third adjacent side by preprocessing software, and extend the third adjacent side to both ends for a predetermined length and then expand the third Adjacent sides form a third rectangle; the first rectangle and the second rectangle are logically summed to obtain the first figure, and the first figure and the third rectangle are logically negated to obtain the first polygon; the original object The graphics and the first polygon are merged to obtain the processed target graphics. The beneficial effect of the present invention is that the graphic gap on the hypotenuse can be filled in a targeted manner, thereby removing factors that are not conducive to optical proximity correction, and making the OPC result better meet expectations.

Description

technical field [0001] The invention relates to the technical field of microelectronic optical proximity correction, in particular to a preprocessing method before optical proximity correction. Background technique [0002] With the continuous development of integrated circuit technology, model-based OPC (Optical ProximityCorrection, short for Optical Proximity Correction) has been widely used in the key-level mask manufacturing process. Model-based OPC can simulate well according to the established model. In the imaging on the silicon wafer after exposure, by compensating the reticle pattern, the pattern on the silicon wafer can be consistent with the design or target pattern, and the pattern distortion caused by the optical proximity effect can be solved. [0003] Model-based OPC will cut the target graphic into segments according to the rules, and set measurement points on the segments, and make corrections while simulating, and finally make the simulation results consist...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F1/36
CPCG03F1/36
Inventor 张浩张辰明陈翰
Owner SHANGHAI HUALI MICROELECTRONICS CORP