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Optical assembly, optical projection module, sensing device and device

An optical component and optical microstructure technology, applied in the optical field, can solve the problems of the 3D face recognition module affecting the recognition effect, not conforming to the design trend of thin electronic equipment, etc., and achieve the effect of reducing the thickness

Pending Publication Date: 2019-01-11
SHENZHEN FUSHI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Existing three-dimensional (Three Dimensional, 3D) face recognition modules are usually made relatively thick due to the need to ensure sufficient optical path internally, which does not conform to the current design trend of thinning electronic equipment
And if the internal optical path of the 3D face recognition module is compressed in order to meet the thin design, it will affect its recognition effect

Method used

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  • Optical assembly, optical projection module, sensing device and device
  • Optical assembly, optical projection module, sensing device and device
  • Optical assembly, optical projection module, sensing device and device

Examples

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Embodiment Construction

[0050] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, are only for explaining the present application, and should not be construed as limiting the present application. In the description of the present application, it should be understood that the terms "first" and "second" are only used for description, and cannot be interpreted as indicating or implying relative importance or implicitly indicating the quantity or arrangement of indicated technical features order. Therefore, the technical features defined as "first" and "second" may explicitly or implicitly include one or more of said technical features. In the description of the present application, "plurality" means two or more, unless other...

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Abstract

The invention is applicable to the field of optics and electronics, the present application provides an optical assembly for projecting a pattern beam of a predetermined pattern onto a measured objectfor sensing. The optical assembly includes an optical path deflection part which is an optical dense medium compared to air. When a light beam enters the optical path deflection part, it propagates in a first direction inside the optical path deflection part, and when the light beam propagates to an inclined surface of the optical path deflection part, it is reflected and deflected to a second direction different from the first direction for transmission. The optical path deflection part includes an optical path deflection part and an optical path deflection part. And a pattern generation unit for rearranging the light field of the incident light beam to form a pattern beam capable of projecting a predetermined pattern. The present application also provides an optical projection module, sensing device and apparatus including the optical assembly.

Description

technical field [0001] The present application belongs to the field of optical technology, and in particular relates to an optical component, an optical projection module, a sensing device and equipment. Background technique [0002] The existing three-dimensional (Three Dimensional, 3D) face recognition module is usually made relatively thick due to the internal need to ensure sufficient optical path, which does not conform to the current design trend of thinning electronic equipment. And if the internal optical path of the 3D face recognition module is compressed in order to meet the thin design, it will affect its recognition effect. Contents of the invention [0003] The technical problem to be solved in this application is to provide a new type of optical component, optical projection module, sensing device and equipment, which can meet the thinning design requirements while maintaining a sufficient optical path. [0004] An embodiment of the present application prov...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03B21/20G02B27/42G01B11/00
CPCG02B27/4205G03B21/2033G03B21/2066G01B11/00
Inventor 王小明
Owner SHENZHEN FUSHI TECH CO LTD