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A wafer bonding method and device

A wafer bonding and wafer technology, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem of low alignment accuracy of wafer bonding and achieve high alignment accuracy and high alignment accuracy , to avoid the effect of dislocation

Active Publication Date: 2019-01-11
WUHAN XINXIN SEMICON MFG CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a wafer bonding method and device to solve the problem of low alignment accuracy of wafer bonding in existing wafer bonding methods

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  • A wafer bonding method and device
  • A wafer bonding method and device
  • A wafer bonding method and device

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Embodiment Construction

[0032] The wafer bonding method and device proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will be more apparent from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0033] figure 1 is a schematic flowchart of a wafer bonding method according to an embodiment of the present invention. figure 2 with image 3 A schematic structural diagram of a wafer bonding apparatus during a bonding process provided by an embodiment of the present invention. Figure 4 with Figure 5 It is a structural schematic diagram of another wafer bonding device during the bonding process provided by an embodiment of the present invention. Among them, such...

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Abstract

The invention provides a wafer bonding method and device. The method comprises that a first wafer is fixed using a first wafer chuck, a second wafer is fixed using a second wafer chuck, applying pressure to the first wafer in a direction toward the second wafer using the first pressing assembly, and applying pressure to the second wafer in a direction toward the first wafer using the second pressure applying assembly, so that the first bonding portion of the first wafer and the second bonding portion of the second wafer are moved close to each other and bonded to each other, the first wafer isdisengaged from the first wafer chuck and the second wafer is disengaged from the second wafer chuck, and the first wafer and the second wafer are fully bonded to each other. The wafer bonding alignment accuracy of the wafer bonding method in the invention is high.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer bonding method and device. Background technique [0002] In the manufacturing process of semiconductor integrated circuits, it is usually necessary to use a wafer bonding process to bond two wafers together. [0003] The traditional wafer bonding process is, for example, as follows: First, provide the first wafer and the second wafer that need to be bonded, and make the first wafer and the second wafer face each other; secondly, first wafer the first wafer A physical force is applied to a partial area of ​​the first wafer, so that a partial area of ​​the first wafer moves toward a direction close to the second wafer, and is bonded to the second wafer. Finally, other areas of the first wafer except the partial area are bonded to the second wafer, so that the two wafers are completely bonded. [0004] However, in the above-mentioned wafer bonding proce...

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Application Information

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IPC IPC(8): H01L21/67H01L21/18
CPCH01L21/187H01L21/67011H01L21/67092
Inventor 刘洋
Owner WUHAN XINXIN SEMICON MFG CO LTD