A heat dissipation structure of a COB type LED packaging unit

Abstract

The invention relates to a heat dissipation structure of a COB type LED packaging unit, including a housing. The invention is characterized in the the shell is a hollow structure, the inner wall of the lower end of the shell is provided with an encapsulation base, and a driving motor is fixedly connected with an inner wall of one side of the housing, the drive motor is provided with a cam matchedwith the output shaft thereof, two vertically arranged hydraulic telescopic rods are fixedly connected with the inner wall of the lower end of the shell, and the hydraulic telescopic rods are respectively arranged on the two sides of the package base, Between the upper end side wall of the two hydraulic telescopic rods are fixedly connected a pressure plate arranged transversely, and the upper endside wall of the pressure plate is arranged in contact with a cam; the upper end side wall of the hydraulic telescopic rod is sleeved with a first spring; air inlet holes are arranged on both side walls of the shell, and a plurality of air outlet holes are arranged on the lower end side walls of the shell. A cam and a spring are used for lifting and lowering the pressing plate, and the air is extruded out of the shell through the lifting and lowering of the pressing plate to take away heat, thereby playing an excellent heat dissipation effect.

Description

technical field [0001] The invention relates to the technical field of package unit heat dissipation, in particular to a heat dissipation structure of a COB LED package unit. Background technique [0002] COB-type LED packaging is to adhere the bare chip to the interconnection substrate with conductive or non-conductive adhesive, and then perform wire bonding to realize its electrical connection. Compared with in-line and SMD, it is characterized by saving space and simplifying packaging operations. When the package base is in operation, it will also generate a lot of heat, and the service life of the package base will be reduced if it is in a high temperature state for a long time. [0003] When dissipating heat from the COB-type LED packaging unit, air inlets and outlets are provided on the side wall of the housing, and the heat of the packaging unit is taken away through the circulation of air to achieve the effect of heat dissipation. However, the rate of natural air cir...

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problems in the prior art that the rate of natural circulation of air is slow, the efficiency of heat dissipation is low, a large amount of heat cannot be dissipated in time when the packaging unit is working, and its service life will be reduced when working in a high temperature environment. A heat dissipation structure of a COB LED packaging unit

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