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protective film
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A technology of protective film and film base material, which is applied in the field of film materials and can solve problems such as not easy to be peeled off
Active Publication Date: 2021-10-22
ZHANGJIAGANG KANGDE XIN OPTRONICS MATERIAL
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Problems solved by technology
[0005] The main purpose of the present invention is to provide a protective film to solve the problem that the protective film in the prior art is not easy to be peeled off after forming a vacuum bond with the protected plane
Method used
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Examples
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Embodiment 1
[0054] This example provides a structure such as figure 1 The protective film shown includes, from bottom to top: a wear-resistant conductive functional layer, a film substrate, a pressure-sensitive adhesive layer, and an adhesion-reducing layer, wherein the adhesion-reducing layer is located at the four corners of the pressure-sensitive adhesive layer. The film substrate is a PI layer, and the material of the pressure-sensitive adhesive layer is Dow Corning's 926 type reactive polysiloxane (corresponding to R in 8 with R 9 Both are epoxy groups, M=80).
[0055] The production process is as follows:
[0056] Production of Viscosity Reducing Silicone
[0057] 97 parts of Silsurf A010-D were physically mixed with 3 parts of Silmer NCO Di-100 and stored dry (isocyanate and hydroxyl based heat cure crosslinking).
[0058] Preparation of protective film
[0059] Prepare a protective film including a wear-resistant conductive functional layer, a film substrate, and a polysilo...
Embodiment 2
[0061] The structure of the protective film is the same as in Example 1. The production process is as follows:
[0062] Production of Viscosity Reducing Silicone
[0063] 96 parts of UV3500 and 4 parts of 2-hydroxy-cyclohexyl benzophenone were mixed and stirred, and stored dry (based on ultraviolet light irradiation initiator to initiate double bond crosslinking in acrylate).
[0064] Preparation of protective film
[0065] Prepare a protective film including a wear-resistant conductive functional layer, a film substrate, and a polysiloxane pressure-sensitive adhesive as the film to be treated, and apply the above-mentioned viscosity-reducing silica gel to the four corners above the pressure-sensitive adhesive, and the dry film thickness of the adhesion-reducing layer is 6 μm , The dry film thickness of the polysiloxane pressure-sensitive adhesive is 2 μm, and it is irradiated with ultraviolet light (250-380nm) under nitrogen protection (oxygen content less than 50ppm) to fo...
Embodiment 3
[0067] The structure of the protective film is the same as in Example 1. The production process is as follows:
[0068] Production of Viscosity Reducing Silicone
[0069] 98 parts of PLOY200 and 2 parts of diaryliodonium hexafluoroantimonate were mixed and stirred, and stored dry (based on ultraviolet light irradiation initiator to initiate cross-linking of epoxy groups).
[0070] Preparation of protective film
[0071] Prepare a protective film including a wear-resistant conductive functional layer, a film substrate, and a polysiloxane pressure-sensitive adhesive as the film to be treated, and coat the above-mentioned viscous-reducing silica gel on the four corners above the pressure-sensitive adhesive, with a dry film thickness of 4-6 μm. Irradiate with ultraviolet light (200-280nm) to form a protective film.
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Abstract
The invention provides a protective film, which includes a film base material and a pressure-sensitive adhesive layer on one side surface of the film base material, wherein the pressure-sensitive adhesive layer includes a first adhesive area and a second adhesive area located on the periphery of the first adhesive area. In the second rubber area, part or all of the second suburban area is provided with a debonding layer on the surface of the side away from the film base material. The raw materials of the debonding layer include oligomers with silicon-oxygen bonds as the main chain, and the pressure-sensitive adhesive layer The raw material includes reactive polysiloxane, and the dyne value of the debonding layer is smaller than that of the pressure-sensitive adhesive layer. Since both the material of the debonding layer and the material of the pressure-sensitive adhesive layer have selected the glue of the silicone structure, and the dyne value of the debonding layer is smaller than the dyne value of the pressure-sensitive adhesive layer, the material of the debonding layer can The adhesive layer spreads out well, and at the same time acts as a viscous reducer. When the pressure-sensitive adhesive layer in the protective film is vacuum bonded to the surface to be protected, the debonding layer can effectively reduce the adhesion between the area where it is located and the surface to be protected, and improve the problem that the protective film is not easy to peel off.
Description
technical field [0001] The invention relates to the technical field of film materials, in particular to a protective film. Background technique [0002] In order to prevent the display screen or frame of mobile phones, computers, TVs and other devices from being scratched by accidental friction and touch during transportation, it is generally necessary to attach a protective film to the protective surface for protection. At present, the back adhesive of the protective film is usually a layer of silicone pressure-sensitive adhesive. Silicone pressure-sensitive adhesive is a commonly used silicone rubber, which can bond both low-energy surfaces and high-energy surfaces. It has a long service life and can be used in both low-temperature and high-temperature environments. It can bond a variety of materials. The solvent resistance, weather resistance, moisture resistance and electrical properties of silicone pressure-sensitive adhesives are incomparable to other adhesives. Apply...
Claims
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Application Information
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