Semicondcutor device package and method of forming semicondcutor device package
A semiconductor and carrier technology, applied in the field of semiconductor device packaging, can solve problems such as warpage deterioration, connector bump cracks, and packaging process yield adverse effects
Active Publication Date: 2019-01-15
TAIWAN SEMICON MFG CO LTD
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- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Warpage of the package substrate can cause irregular connectors and / or bump cracks
Warpage can be further exacerbated by the asymmetric arrangement of the device die over the redistribution structure
Therefore, it adversely affects the yield of the packaging process
Method used
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[0047] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are set forth below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, in the following description, forming a first feature on or over a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which the first feature is formed in direct contact with the second feature. Embodiments in which additional features may be formed between the first and second features such that the first and second features may not be in direct contact. Additionally, this disclosure may reuse reference numbers and / or letters in various instances. Such re-use is for simplicity and clarity and does not in itself indicate a relationship between the v...
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A semiconductor device package includes a redistribution structure, a first semiconductor device, a plurality of second semiconductor devices, at least one warpage adjusting component, and an encapsulating material. The first semiconductor device is disposed on the redistribution structure. The second semiconductor devices are disposed on the redistribution structure and surround the first semiconductor device. The at least one warpage adjusting component is disposed on at least one of the second semiconductor devices. The encapsulating material encapsulates the first semiconductor device, thesecond semiconductor devices and the warpage adjusting component, wherein a Young's modulus of the warpage adjusting component is greater than or equal to a Young's modulus of the encapsulating material.
Description
technical field [0001] The present disclosure relates to a semiconductor device package and a method of forming a semiconductor device package. Background technique [0002] During packaging of integrated circuits, device dies, which can be stacked vertically as well as horizontally, are packaged onto the redistribution structure. The device die may be bonded to one side of the redistribution structure using flip chip bonding, and reflow performed to melt the solder balls used to interconnect the die with the redistribution structure. A molding compound is then applied over the package, wherein the molding compound covers the device die and solder balls. [0003] However, there is a significant difference between the Coefficient of Thermal Expansion (CTE) of each material in the package. For example, the coefficient of thermal expansion of the redistribution structure and molding compound is much higher than that of the device die. Therefore, in the resulting package, the...
Claims
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Login to View More IPC IPC(8): H01L23/24H01L25/18H01L21/56
CPCH01L21/56H01L23/24H01L25/18H01L2224/16225H01L2224/32225H01L2224/73204H01L2224/73253H01L2924/15311H01L2924/18161H01L23/562H01L21/6835H01L2221/68345H01L2221/68381H01L23/3128H01L23/5383H01L23/49816H01L25/0655H01L2924/00H01L21/4857H01L21/563H01L23/3736H01L25/50H01L23/3731H01L23/3738
Inventor 林柏尧洪成佾许峯诚陈硕懋郑心圃叶书伸李光君
Owner TAIWAN SEMICON MFG CO LTD