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Cover plate, forming method thereof, cover plate mother board and electronic equipment

A cover and motherboard technology, applied in the direction of circuits, electrical components, optics, etc., can solve problems such as difficult to meet product needs, poor performance of glass cover, etc., to achieve the effect of ensuring yield, reducing reliability risk and improving effect

Inactive Publication Date: 2019-01-18
SHANGHAI OXI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the performance of the textured glass cover plate formed by the existing process is poor, and it is difficult to meet the needs of the product

Method used

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  • Cover plate, forming method thereof, cover plate mother board and electronic equipment
  • Cover plate, forming method thereof, cover plate mother board and electronic equipment
  • Cover plate, forming method thereof, cover plate mother board and electronic equipment

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Experimental program
Comparison scheme
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Embodiment Construction

[0028] It can be seen from the background art that the textured glass cover plate in the prior art often has the problem of poor performance. Now combine the structure of the textured glass cover to analyze the reasons for its poor performance:

[0029] refer to figure 1 , shows a schematic cross-sectional structure of a glass cover plate.

[0030] There are two mainstream ways to make the glass cover appear textured, one is as figure 1 Rupture-proof membrane technology shown. Such as figure 1 As shown, the glass cover plate formed by the explosion-proof film technology includes: a glass base layer 11; an optical adhesive layer 12 covering the surface of the glass base layer 11; a resin layer 13 covering the surface of the optical adhesive layer 12; covering the resin layer 13 a graphic layer 14 on the surface; a black matrix layer 17 located on the graphic layer 14 .

[0031] Wherein, the material of the optical adhesive layer 12 is optically transparent adhesive (Optica...

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PUM

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Abstract

The invention discloses a cover plate, a forming method thereof, a cover plate mother board and electronic equipment. The forming method of the cover plate comprises the following steps: providing a mother board base, wherein the mother board base comprises a base layer and a sacrificial layer positioned on the base layer; carrying out schematization on the sacrificial layer to form a graphic sacrificial layer; and by using the graphic sacrificial layer as a mask, etching the base layer to form a substrate and a texture bulging the substrate. The substrate and the texture are formed by etchingthe base layer, compared with a glass cover plate comprising a UV glue material graphic layer, the application of the UV glue material graphic layer is omitted, the problems caused by the UV glue material graphic layer and a forming technology thereof can be avoided effectively, the performance, reliability and manufacturing yield of the formed cover plate are improved, the structure of the coverplate is simplified, the light transmittance of the cover plate is improved, and the performance and aesthetic degree of the formed electronic equipment are improved.

Description

technical field [0001] The invention relates to the field of fingerprint imaging, in particular to a cover plate and a forming method thereof, a cover plate motherboard and electronic equipment. Background technique [0002] In portable electronic devices represented by smart phones and tablet computers, in order to protect display devices such as liquid crystal panels, a transparent protective plate is usually provided on the outermost layer of the display device. As the protective plate, resin materials such as acrylic were mostly used in the past. However, since the protective plate made of resin is easy to bend, the thickness of the protective plate is relatively large, or the gap between the protective plate and the display device is relatively large, so as to prevent the display device from being damaged due to the formation of the protective plate. [0003] In order to improve the protective function of the protective plate, increase the rigidity of the protective pl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B1/10G02B1/12H01L21/84
CPCG02B1/10G02B1/12H01L21/84
Inventor 陆震生朱虹
Owner SHANGHAI OXI TECH
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