Application of block copolymers in the construction of specific nanostructures in epoxy resins and the preparation of high-toughness composites
A technology of block copolymer and epoxy resin, which is applied in the direction of epoxy resin coating, epoxy resin glue, adhesive type, etc., can solve the problem of poor impact resistance and peeling resistance, difficult sliding between molecular chains, and EP curing Insufficient physical toughness and other problems
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Embodiment 1
[0036] Embodiment 1, preparation and performance detection of composite material of the present invention
[0037] One, the preparation of composite material of the present invention
[0038] 1. Experimental materials and reagents
[0039] Bisphenol A glycidyl ether epoxy resin E-51 (DGEBA), purchased from Jiangsu Wuxi Resin Factory;
[0040] 3,3'-dichloro-4,4'-diaminodiphenylmethane (MOCA), purchased from Changshan Bell Co., Ltd.;
[0041] Monohydroxyl-terminated polydimethylsiloxane (PDMS-OH) was provided by Shin-Etsu Chemical Co., Ltd., Japan. Adopt anhydrous toluene azeotropic distillation before use;
[0042] ε-caprolactone (ε-CL), purchased from Aladdin, 99%, treated with calcium hydride (CaH 2 ) after drying, distillation under reduced pressure;
[0043] Stannous octoate (Sn(Oct) 2 ), purchased from Aladdin.
[0044] 2. Synthesis of Diblock Copolymer PDMS-b-PCL
[0045]
[0046] Add the polydimethylsiloxane PDMS-OH and caprolactone monomer and 0.1%wt stannous o...
Embodiment 2
[0090] The PDMS-PCL / EP composite material prepared in Example 1 is used as the matrix resin, and the commonly used modifiers in the fields of coatings, electrical materials, casting packaging materials, adhesives, sealants, etc. are prepared to prepare coatings, electrical materials, Pouring packaging materials, adhesives, sealants.
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