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A kind of solid crystal method and terminal

A die-bonding and terminal technology, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of low alignment accuracy, slow die-bonding speed, and low efficiency, and achieve the effect of improving die-bonding precision and high die-bonding efficiency

Active Publication Date: 2019-09-17
江苏佑光科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] With the development of LED technology, Mini LED will be the core of the next-generation backlight technology. When traditional die-bonding equipment is used to bond Mini LED wafers, the die-bonding speed is slow, the efficiency is low, and the alignment accuracy is low. , will seriously affect the use of Mini LED in the later stage

Method used

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  • A kind of solid crystal method and terminal
  • A kind of solid crystal method and terminal

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Embodiment 1

[0075] Please refer to figure 1 , Embodiment 1 of the present invention is:

[0076] A kind of solid crystal method, comprises the steps:

[0077] S1. Respectively preset the reference point for die bonding, the reference point for the wafer to be fixed, and the reference point for the position of the die to be bonded. The settings of the three reference points are all carried out in the same coordinate system. The reference point for die bonding is the specific coordinates at which the wafer to be fixed is fixed at the position to be bonded. Here, it specifically refers to the coordinates in the X and Y directions on the horizontal plane. Both the reference point of the wafer to be fixed and the reference point of the position of the wafer to be fixed refer to the coordinates in the X and Y directions on the horizontal plane.

[0078] S2. Respectively acquire first image information of at least two wafers to be fixed. The first image information is obtained through a large...

Embodiment 2

[0086] Please refer to figure 2 , the second embodiment of the present invention is:

[0087] A die-bonding terminal 100, corresponding to the method in Embodiment 1. The die-bonding terminal 100 includes a processor 1, a memory 2, and a computer program stored in the memory 2 and operable on the processor 1,

[0088] When the processor 1 executes the computer program, the following steps are implemented:

[0089] Respectively preset the reference point of die bonding, the reference point of wafer to be fixed and the reference point of the position of die to be bonded;

[0090] respectively acquiring first image information of at least two wafers to be fixed;

[0091] Calculate and obtain at least two coordinate deviations of the wafer to be fixed according to the first image information and the reference point of the wafer to be fixed;

[0092] adjusting at least two of the wafers to be fixed according to the coordinate deviation of the at least two wafers to be fixed an...

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Abstract

The invention discloses a die bonding method and terminal. The die bonding method comprises the steps of respectively obtaining first image information of at least two wafers to be bonded; respectively calculating the coordinate deviation of the wafers to be bonded according to the first image information and reference points of the wafers to be bonded; adjusting the at least two wafers to be bonded according to the coordinate deviation of the wafers to be bonded and the die bonding reference points; respectively obtaining second image information of at least two die bonding positions; respectively calculating the coordinate deviation of the die bonding positions according to the second image information and die bonding position reference points; adjusting the at least two die bonding positions according to the coordinate deviation of the die bonding positions and the die bonding reference points; and bonding the at least two adjusted wafers to be bonded at the at least two adjusted die bonding positions. The die bonding method can greatly improve the die bonding efficiency and die bonding accuracy, and is applicable to carrying out batch die bonding on Mini LEDs.

Description

technical field [0001] The invention relates to the technical field of crystal bonding, in particular to a crystal bonding method and a terminal. Background technique [0002] With the development of LED technology, Mini LED will be the core of the next-generation backlight technology. When traditional die-bonding equipment is used to bond Mini LED wafers, the die-bonding speed is slow, the efficiency is low, and the alignment accuracy is low. , will seriously affect the use of Mini LED in the later stage. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a crystal bonding method and a terminal, which can greatly improve the crystal bonding efficiency and crystal bonding precision. [0004] In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is: [0005] A crystal bonding method, comprising: [0006] Respectively preset the reference point o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48
Inventor 张跃春梁国康梁国城李金龙程飞
Owner 江苏佑光科技股份有限公司
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