A method for encapsulating LED modules used in automobile headlights

Abstract

The invention discloses a LED module packaging method for automobile headlights, which includes: (a) aligning the area of ​​the middle substrate provided with a plurality of chip pads with the through-slot structure of the upper substrate, thereby performing the middle layer and Bonding of the upper substrate; (b) dripping solder on the chip pad, and using the liquid surface tension of the solder to automatically perform alignment adjustments between the chip and the chip pad; (c) performing soldering between the lower substrate and the middle substrate , and complete the circuit connection of each LED chip; (d) fill the mixture of ceramic powder and silica gel in the side area where each chip is spaced apart from each other, and then perform heat curing; (e) continue to fill the phosphor powder into the through groove structure of the upper substrate Glue until the entire through-slot structure is filled, and then the entire module is cured at elevated temperatures. The invention can effectively solve the self-heating problem of the fluorescent powder, improve the thermal reliability of the module, and improve the light efficiency and light output quality of the module.

Description

technical field [0001] The invention belongs to the technical field of auto parts, and more particularly relates to a packaging method for an LED module used in an automobile headlight. Background technique [0002] LED (Light Emitting Diode) is a semiconductor light-emitting device based on the principle of P-N junction electroluminescence. Compared with ordinary light sources, it has long service life, short start-up time, high electro-optic conversion efficiency, and is easy to realize AFS function and car lights. Due to its flexible shape and other advantages, it has been widely used in the field of automotive light sources. At present, foreign LED headlights have changed from high-end models to low-end models, and domestic manufacturers have also followed up, which has led to a rapid increase in the demand for LED headlight modules, which has huge market potential. [0003] However, for the existing LED light source modules for automotive headlamps, since automotive li...

AI Technical Summary

Problems solved by technology

In view of the above problems, the main solution in the prior art is to use flip-chip LED chips or vertical electrode LED chips, which will greatly increase the chip cost; The method to improve packaging precision is mainly to improve the precision of die-bonding equipment, but this will also greatly increase the packaging cost of the module

[0004] In addition, the existing LED light source modules for automotive headlights still have some problems such as high module temperature, poor moisture insulation effect, low reliability and service life, etc.

Due to the self-heating phenomenon of the phosphor in the LED module, the harsh heat dissipation conditions cause the temperature of the phosphor layer to be much higher than the junction temperature of the chip, which becomes a bottleneck of thermal reliability, and the influence on the chip temperature greatly reduces the reliability of the chip

For the problem of high module temperature, the existing solution is mainly to change the concentration of phosphor to improve the distribution of phosphor, but it will reduce the light efficiency of the module at the same time, making it difficult to carry out efficient photothermal co-design

At the same time, the use environment of the car light module is changeable and harsh, and the phosphor silica gel layer is more likely to permeate moisture, which will greatly reduce the reliability and service life of the chip; the current solution is mainly to use a sealant to seal the car light shell to isolate Outside air, but it will bring problems such as one-time use of lights, difficulty in designing peripheral heat dissipation, etc.

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