10results about How to "Improve Die Bonding Efficiency" patented technology

A carrier tape bonding device for flip chip bonding includes a carrier tape, a driving mechanism for driving the carrier tape to move, and a bonding mechanism; the bonding mechanism includes a bonding seat with an arc-shaped lower surface, a pin mounting groove arranged at the bottom of the bonding seat and opening downward, and a pin arranged in the pin mounting groove, the carrier tape is wound around the lower surface of the bonding seat, the driving mechanism drives the carrier tape to move along the lower surface of the bonding seat, the surface of the carrier tape away from the side of the bonding seat forms a chip mounting area, a number of flipped chips are arranged in the chip mounting area along the extension direction of the carrier tape, the pin moves downward to pierce the carrier tape and bond the chip downward. The above technical solution can realize flip chip without film inversion and efficient bonding, and the present invention also provides a corresponding bonding method.

The present application provides a method for bonding LED chips and an LED device, the method for bonding LED chips comprising: making a printed circuit layer on a flexible substrate, and coating solder paste on the pads of the printed circuit layer; arranging and fixing a plurality of LED chips on an optical film in advance according to the distribution of the pads on the printed circuit layer; controlling the optical film and the flexible substrate to maintain the same expansion and contraction, and embossing the optical film and the flexible substrate and heating and curing. The method for bonding LED chips of the present application has a fast bonding speed, high efficiency and a simple process flow.

The invention discloses a Mini-led matrix integrated packaging device for a direct-screen PCB substrate, and belongs to the technical field of semiconductors. The die bonder mainly comprises a die bonder body, the die bonder body comprises a die bonding structure, the die bonding structure comprises a die taking mechanism, a die distributing mechanism and a support, the die taking mechanism comprises a rotating wheel and a plurality of suction nozzle assemblies, the rotating wheel is rotatably matched on the support, each suction nozzle assembly comprises a rod body, a die taking suction nozzle, a first driver, a rotating table and a second driver, and the rod body is slidably connected to the rotating table. The crystal taking suction nozzle is arranged at the first end of the rod body, the first driver can drive the rod body to swing, the crystal distribution mechanism comprises a vertically-arranged core rod, the core rod is located in the center of the multiple suction nozzle assemblies, the core rod can do linear reciprocating motion relative to the support in the axial direction of the core rod, and meanwhile the core rod can rotate around the axis of the core rod. The lower end of the core rod is provided with a die bonding suction head, and the die bonding suction head is provided with a plurality of die bonding suction ports. According to the Mini-led matrix integrated packaging equipment for the direct-screen PCB substrate, the die bonding efficiency during packaging can be improved.

The utility model relates to the technical field of die bonding devices, and discloses a die bonding device for Mini RGB, which comprises a die bonding table, a support frame is fixedly connected between the front part and the rear part of the upper end of the die bonding table, the middle part of the upper end of the support frame is movably connected with a die bonding mechanism in a penetrating manner, and the lower part of the front end of the support frame is fixedly connected with a controller. A moving groove is formed in the right portion of the upper end of the die bonding table, a fixing block is fixedly connected to the middle of the right end of the die bonding table, a moving mechanism is jointly inserted and movably connected between the upper portion of the right end of the fixing block and the middle of the rear groove wall of the moving groove, and a die storage disc is fixedly connected to the left portion of the upper end of the die bonding table. According to the die bonding device used for Mini RGB, through arranging the die bonding mechanism and the rotating mechanism, adsorption and surface mounting of a wafer are carried out at the same time, die bonding efficiency is improved, through arranging the moving mechanism, the position of the substrate can be flexibly adjusted, die bonding requirements of different positions of the substrate are satisfied, and the die bonding device is suitable for wide application.

The utility model discloses a die bonder capable of conveniently adjusting a die bonding range, which relates to the technical field of die bonders and comprises a connecting seat, a push block is slidably connected onto the connecting seat, a positioning camera is mounted at the bottom end of the push block, a plurality of inserting shafts are inserted into the connecting seat, one end of each inserting shaft is rotatably connected with a pulley, and the other end of each inserting shaft is rotatably connected with a rotating shaft. A plurality of sliding grooves are formed in the pushing block, the sliding wheels are connected to the sliding grooves in a sliding mode, the other end of the inserting shaft is fixedly connected with a connecting rod, a suction nozzle is installed at the end of the connecting rod, one end of the suction nozzle is fixedly connected with an installing block, and a positioning rod is connected to the installing block in an inserted mode. According to the utility model, the connection seat, the push block, the positioning camera, the insertion shaft, the pulley, the chute, the connection rod, the first spring, the suction nozzle, the installation block, the positioning rod, the second spring, the installation seat and the second cylinder are arranged to form a wafer fixing structure adaptive to different sizes, an existing die bonder is replaced, the wafer fixing structure is adaptive to different sizes, and the die bonding efficiency is high.

The present application relates to a high-speed crystal bonding machine with double glue dispensing heads, which belongs to the field of crystal bonding technology. In the related technical means, since the time of glue dispensing in a single cycle is usually longer than the time of movement of the crystal welding head in a single cycle, the crystal bonding efficiency of the whole equipment cannot be further improved. The present application provides a high-speed crystal bonding machine with double glue dispensing heads, which includes a frame, a bracket feeding mechanism, a bracket glue dispensing mechanism, a bracket docking mechanism, a chip feeding mechanism, a welding head crystal bonding mechanism and a bracket unloading mechanism. The bracket glue dispensing mechanism receives and accommodates the crystal bonding bracket and performs glue dispensing. The bracket docking mechanism transfers the crystal bonding bracket that has completed the glue dispensing operation to the crystal bonding preparation position. The welding head crystal bonding mechanism absorbs the chip from the chip feeding mechanism and transfers it to the crystal bonding bracket on the bracket docking mechanism for crystal bonding. The glue dispensing action and the crystal bonding action are separated by the bracket docking mechanism, so that the time of the two actions can overlap, thereby improving the working efficiency of the double glue dispensing head high-speed crystal bonding machine.

The utility model relates to a chip pick-and-place device and a semiconductor die bonder, in the chip pick-and-place device, a moving mechanism is utilized to drive a pick-up mechanism to move in a first direction and a second direction, so that the pick-up mechanism moves to a position above a chip to be processed. According to the pick-up mechanism, at least two parallel pick-up assemblies are arranged on the mounting seat, so that the mounting seat is driven by the moving mechanism to move along the third direction, each pick-up assembly respectively picks up the corresponding chip, at least two chips can be synchronously picked up in the die bonding process, the pick-and-place efficiency of the chips is effectively improved, and the die bonding efficiency is further improved.

The present invention discloses an adsorption device and a crystal bonding machine for crystal bonding, the adsorption device comprises: an adsorption area, which is covered with an elastic material, and the elastic material is provided with at least two micropores, and the aperture of each micropore is greater than or equal to 0.01 mm; a non-adsorption area, which is provided with at least one through hole, and the non-adsorption area includes a connecting sub-area, and the connecting sub-area is directly connected to the elastic material of the adsorption area, and is used to support the elastic material, and the material of the connecting sub-area is a rigid material; wherein the adsorption area and the non-adsorption area jointly form a cavity, and the through hole is connected to the cavity, and the through hole is used to connect to an external vacuum device, and the adsorption device can absorb more than two wafers at a time through at least two micropores on the elastic material of the adsorption area under the vacuum action of the external vacuum device. In this way, the present invention can efficiently bond the crystal, with low cost, and will not crush the wafer or leak the wafer.

The utility model discloses a die bonder with a double-layer conveying function, and relates to the technical field of die bonders, the die bonder comprises a rack, a control assembly and a working platform, the control assembly is installed on one side of the rack, the working platform is installed in the rack, a material preparation assembly and a feeding cross beam are arranged on the upper side of the working platform, and the feeding cross beam is arranged on the lower side of the rack. A first die bonding assembly and a second die bonding assembly are arranged on the upper side of the feeding cross beam, and a placing platform is arranged on one side of the rack. According to the die bonder with the double-layer conveying function, when the die bonder ascends, the die bonder is convenient to convey, when the die bonder descends, the die bonder is adsorbed by the vacuum adsorption area, and the first wafer rack and the second wafer rack are arranged in opposite directions, so that double-layer conveying is realized, and meanwhile, the feeding distance and interval of the die bonder are improved and accurately controlled; according to the die bonder with the double-layer conveying function, the problems that an existing die bonder cannot accurately control the feeding distance and interval, and die bonding dislocation is prone to occurring during die bonding are solved.