2results about How to "Improve Die Bonding Efficiency" patented technology

The utility model relates to a chip pick-and-place device and a semiconductor die bonder, in the chip pick-and-place device, a moving mechanism is utilized to drive a pick-up mechanism to move in a first direction and a second direction, so that the pick-up mechanism moves to a position above a chip to be processed. According to the pick-up mechanism, at least two parallel pick-up assemblies are arranged on the mounting seat, so that the mounting seat is driven by the moving mechanism to move along the third direction, each pick-up assembly respectively picks up the corresponding chip, at least two chips can be synchronously picked up in the die bonding process, the pick-and-place efficiency of the chips is effectively improved, and the die bonding efficiency is further improved.