37results about How to "Improve Die Bonding Efficiency" patented technology

A high-speed die bond method for crystal by automatic image recognition is characterized in that the die bond method comprises the following steps: (1) a wafer platform and a circuit board platform realize driving in X and Y direction, the two platforms all select a Bonder Head position moving up and down as an origin of coordinate, all the origins automatically reset to zero when starting up; (2) image data are input into a computer which is responsible for analyzing, computing and processing the input images, the computer can process a plurality of groups of image data at the same time and match and compute the deviation of coordinates of corresponding points in each group based on the requirements; (3) movement to the place right under the Bonder Head or right above the Bonder Head is carried out according to the regulated time sequence, the wafer is pressed and mounted on the circuit board, thus completing die bond. The method has the advantages that the automatic position controlof computer is adopted, the Bonder Head does not need reciprocation, the die bond efficiency is high, a plurality of groups of die bond images can be processed simultaneously, the cost is saved and the requirement of improving the die bond speed and accuracy is met.

The invention provides a continuous die bonding device and die bonding method of a light emitting diode (LED), and relates to package of an LED chip. The device is provided with a substrate film sending system, a transmission system, a dispersion glue system, a die bonding system, a heating system and a substrate film outlet system, wherein substrate film sending system, a transmission system, the dispersion glue system, the die bonding system, the heating system and the substrate film outlet system are sequentially arranged on a ground surface. The die bonding method comprises the steps of installing the substrate film sending system and the transmission system, and transmitting a substrate by the substrate film sending system and the transmission system; performing dispersion glue on the substrate by the dispersion glue system; performing LED die bonding on the substrate by the die bonding system; curing silver glue by the heating system; and firmly pasting the LED chip on the substrate. By the device and the die bonding method, a high-quality continuous silicon carbide ceramic substrate package product can be obtained, continuous and automatic die bonding of the LED chip on a board of the continuous silicon carbide thin film substrate and industrial production of the package product are achieved, and an LED finished device with more excellent performance is obtained.

The application provides a crystal bonding machine, including a stand; a glue dispensing device; a glue dispensing shift mechanism; a feeding mechanism; a crystal bonding swing arm device; a crystal feeding platform; a crystal bonding shift mechanism; The crystal-bonding swing arm device includes a rotating frame, a plurality of crystal-bonding swing arms, a lifter and a crystal-bonding motor, and suction nozzles are installed on each crystal-bonding swing arm; the dispensing device includes a plurality of dispensing modules. The die bonding machine provided by this application combines multiple dispensing modules with multiple die bonding swing arms, and can adjust multiple dispensing modules under the premise of ensuring the accuracy and quality of dispensing and ensuring accurate chip pick-and-place. The operating speed is matched with the operating speed of multiple die-bonding swing arms, reducing the idle time of each dispensing module and die-bonding swing arms, and greatly improving the efficiency of die-bonding.

The present invention relates to the technical field of crystal-bonding equipment, specifically a LED high-speed crystal-bonding equipment and an automatic loading and unloading device thereof. The LED high-speed crystal-bonding equipment includes a wafer console and a fixture console; The crystal expansion ring is clamped; the upper end of the crystal expansion ring is wrapped with a blue film; the blue film is provided with chips; the chips are evenly distributed on the upper end of the blue film; the LED high-speed crystal bonding equipment in the present invention passes through it A No. 1 motor drives the corresponding movement of the screw slider, and the No. 1 electric push rod drives the injection unit to move, thus completing the dispensing process, and then drives the corresponding screw slider through another No. 1 motor. The sub-movement of the block cooperates with the movement of the injection unit driven by the No. 2 electric push rod, thereby completing the process of placing the core, so that the present invention can fix multiple chips at the same time, thereby realizing the effect of performing multiple solid crystals at the same time, and then The crystal-bonding efficiency of the LED is improved, so that the production efficiency of the LED is improved.

The invention discloses a chip bonding method and a terminal, which receive chip wafers to be bonded, select a corresponding lighting method to light the chips according to the types of chips in the chip wafers, and realize the adaptive matching of chip lighting according to the chip types. Method: conduct electrical performance detection on the lit chip, and judge whether the chip is a good product, if not, do not perform die bonding; Then the chip is sucked for die bonding. If not, the mapping file of the chip wafer is established based on the chip type. It can be seen that the mapping file of the chip wafer is established for the chip that does not belong to the bonding type, and the chips do not need to be placed separately. It can easily and intuitively read the positions of various types of chips according to the mapping file, so that the mapping file can be directly corresponded to the chip wafer during the second die bonding, which improves the die bonding efficiency and saves the cost of die bonding.

The invention provides a full-automatic planar IC die bonder and a die bonding method. The die bonder comprises a rack, a feeding mechanism and a receiving mechanism which are arranged at two ends ofthe rack respectively, a rail mechanism which is arranged between the feeding mechanism and the receiving mechanism; a dispensing mechanism, a lens mechanism and a welding head mechanism which are arranged on a side of the rail mechanism, and a film expanding and crystal ejecting mechanism which is arranged below the rail mechanism. The feeding mechanism is used for feeding an LED support to the rail mechanism, the rail mechanism is used for receiving and transferring the LED support, the dispensing mechanism is used for dispensing the LED support, and the film expanding and wafer jacking mechanism is used for jacking out a wafer on a blue film and fixing the wafer to the LED support under the cooperation of the lens mechanism and the welding head mechanism; the dispensing mechanism comprises a dispensing stand column fixed to the rack, a first dispensing assembly and a second dispensing assembly, wherein the first dispensing assembly and the second dispensing assembly are arranged onthe dispensing stand column. By arranging the two dispensing assemblies, the dispensing efficiency is greatly improved such that the die bonding efficiency is effectively ensured.

The application provides a crystal bonding machine, which includes a frame, a bracket feeding component, a bracket transferring component, a crystal ring feeding component, a crystal ring rotating component, a top crystal component, a crystal ring transferring component, a suction nozzle, a solid crystal Swing arm assembly, suction nozzle supply assembly and material receiving assembly. The bracket can be supplied to the bracket transfer component through the bracket feeding component, and the crystal ring on the crystal ring feeding component can be transferred to the crystal ring transfer component through the crystal ring transfer component, and the crystal ring rotation component can be used After the crystal ring is removed, the wafer on the crystal ring can be ejected to the crystal supply position through the crystal top assembly, and the wafer at the crystal supply position can be transferred to the support transfer assembly through the suction nozzle and the solid crystal swing arm assembly. Complete the die bonding operation of the wafer and the bracket. The crystal ring transfer component can realize the simultaneous operation of crystal ring loading and unloading, which reduces the waiting time for crystal ring loading and unloading, and helps to improve the efficiency of die bonding. Moreover, the automatic replacement of the suction nozzles can be realized through the suction nozzle receiving and supplying assembly, which saves time and labor and has high efficiency.