37results about How to "Improve Die Bonding Efficiency" patented technology

The invention provides a continuous die bonding device and die bonding method of a light emitting diode (LED), and relates to package of an LED chip. The device is provided with a substrate film sending system, a transmission system, a dispersion glue system, a die bonding system, a heating system and a substrate film outlet system, wherein substrate film sending system, a transmission system, the dispersion glue system, the die bonding system, the heating system and the substrate film outlet system are sequentially arranged on a ground surface. The die bonding method comprises the steps of installing the substrate film sending system and the transmission system, and transmitting a substrate by the substrate film sending system and the transmission system; performing dispersion glue on the substrate by the dispersion glue system; performing LED die bonding on the substrate by the die bonding system; curing silver glue by the heating system; and firmly pasting the LED chip on the substrate. By the device and the die bonding method, a high-quality continuous silicon carbide ceramic substrate package product can be obtained, continuous and automatic die bonding of the LED chip on a board of the continuous silicon carbide thin film substrate and industrial production of the package product are achieved, and an LED finished device with more excellent performance is obtained.

The invention provides a die bonder. The die bonder comprises a rack; a dispensing device; a dispensing shifting mechanism; a feeding mechanism; a die bonding swing arm device; a crystal supply platform; a die bonding displacement mechanism; and a material receiving mechanism. The die bonding swing arm device comprises a rotating frame, a plurality of die bonding swing arms, a lifter and a die bonding motor, and each die bonding swing arm is provided with a suction nozzle; the dispensing device comprises a plurality of dispensing modules. The invention provides a die bonder. According to the invention, the plurality of dispensing modules are combined with the plurality of die bonding swing arms, so that the operation speeds of the plurality of dispensing modules can be adjusted to be matched with the operation speeds of the plurality of die bonding swing arms on the premise of ensuring the dispensing precision and quality and ensuring the wafer taking and placing precision, the idle time of each dispensing module and each die bonding swing arm is reduced, and the die bonding efficiency is greatly improved.

The invention discloses a double-swing-arm die-bonding device for LED die bonding and a die bonding method thereof. The die-bonding device comprises a table board, and a double-swing-arm die-bonding mechanism arranged on the table board, wherein a crystal ring moving platform is arranged above the double-swing-arm die-bonding mechanism, and a clamp moving platform is arranged below the double-swing-arm die-bonding mechanism; an automatic crystal ring feeding mechanism is arranged on one side of the clamp moving platform, while a lens assembly is arranged on the other side of the clamp moving platform; and an ejector pin assembly is further arranged above the crystal ring moving platform. The lens assembly is used for assisting the crystal ring moving platform and a clamp to move to a designated position. The ejector pin assembly is used for ejecting an LED wafer on the crystal ring moving platform; the double-swing-arm die-bonding mechanism drives the two die-bonding arms to rotate ina plane perpendicular to the horizontal plane, and then sucks ejected wafers to fix the ejected wafers to an LED bracket; the automatic crystal ring feeding mechanism is used for feeding or recoveringthe crystal ring; and compared with a traditional crystal fixing mode, the die bonding device is used for carrying out continuous die bonding by arranging the two die-bonding swing arms to rotate, sothat the die bonding speed is increased, and the application range is wide.

The invention discloses a die bonding device for processing a music chip of a music player and a using method thereof. The die bonding device comprises a supporting table, a transmission disc, a die bonding box, a glue smearing table and a die pressing seat, the transmission disc is arranged on one side of the upper portion of the supporting table, the cuboid die bonding box is arranged on one side of the transmission disc, the glue smearing table is arranged on one side of the die bonding box, and the die pressing seat is arranged on one side of the glue smearing table. The beneficial effectsof the invention are that: the music chips and the wafers on the plurality of mounting blocks are respectively coated with dot die bonding glue through the dispensing nozzles on the plurality of glueoutlet pumps to improve the die bonding efficiency of the music chips by the device; and when the dispensing nozzles are used for dispensing the die bonding glue, the motor I drives the chips and thewafers in the plurality of buckling frames to continuously and slowly rotate through a rotary mounting block, so that the position of the device for dispensing the die bonding glue is more comprehensive, the automation degree of the device is higher while the die bonding work of the device is more efficient, and the device is very time-saving and labor-saving to use.

The invention provides an LED chip unit and an LED device, and manufacturing methods thereof. Flip LED chips are arranged on the front surface of an adhesive film according to the distribution of corresponding chip electrode bonding pads on a substrate, and an adhesive layer which covers and packages the flip LED chips together is formed on the front surface of the adhesive film; and the adhesive layer is cut to obtain a plurality of LED chip units, each LED chip unit comprises at least two LED flip chips, and the LED flip chips are correspondingly distributed according to the distribution of corresponding chip electrode bonding pads on the substrate. When the LED chip unit is used for manufacturing the LED device, the LED chip unit comprising a plurality of LED chips can be transferred to the substrate, and the positive electrode and the negative electrode of each LED chip in the LED chip unit are electrically connected with the corresponding chip electrode bonding pads on the substrate respectively, so the die bonding efficiency of the LED chip can be multiplied, and the viscisity and the conductivity of elargol and solder paste printed on the bonding pad of the substrate are prevented from becoming poor due to long die bonding time, and the quality and the reliability of an LED device product are improved.

The invention provides a die bonder. The die bonder comprises a rack, a support feeding assembly, a support transferring assembly, a crystal ring feeding assembly, a crystal ring rotating assembly, a crystal jacking assembly, a crystal ring transferring assembly, a suction nozzle, a wafer fixing swing arm assembly, a suction nozzle receiving and feeding assembly and a material receiving assembly. A support can be supplied to the support transferring assembly through the support feeding assembly, a crystal ring on the crystal ring feeding assembly can be transferred to the crystal ring transferring assembly through the crystal ring transferring assembly, the used crystal ring on the crystal ring rotating assembly is removed, and a wafer on the crystal ring can be ejected to a wafer supply position through the wafer ejecting assembly. The wafer at the wafer supply position can be transferred to the support transferring assembly through the suction nozzle and the wafer fixing swing arm assembly, and wafer fixing operation of the wafer and the support is completed. The synchronous operation of feeding and discharging of the crystal ring can be realized through the crystal ring transferring assembly, the waiting time of feeding and discharging of the crystal ring is reduced, and the improvement of the die bonding efficiency is facilitated. Moreover, the suction nozzle can be automatically replaced through the suction nozzle receiving and supplying assembly, time and labor are saved, and the efficiency is high.

The invention provides a COB die bonder. The die bonder comprises a support, a die bonding table, wafer disc conveying mechanisms and swing arms, wherein the die bonding table and the wafer disc conveying mechanisms are respectively arranged on the support, the two wafer disc conveying mechanisms are respectively positioned on two sides of the die bonding table, the two swing arms are respectivelypositioned between the die bonding table and the wafer disc conveying mechanisms, the swing arms are provided with Z-axis motors of which the position can be adjusted up and down, one end of each swing arm is a rotating end, the other end of each swing arm is a wafer grabbing and fixing end, the rotating end of each swing arm is correspondingly connected with a swing arm driving motor, and the swing arm driving motors drive the wafer grabbing ends of the swing arms to reciprocate between the wafer disc conveying mechanisms and the wafer fixing table. The die bonding table is advantaged in that the two swing arms are matched with the two wafer disc conveying mechanisms to carry out die bonding on the die bonding table together so that the die bonding production takt is improved, and die bonding efficiency is improved.

The invention discloses an LED display unit group, comprising a circuit board, and a pixel unit array composed of n rows and m columns of pixel units on the circuit board, wherein n and m are positiveintegers greater than or equal to 2; Wherein each pixel unit comprises at least two LED light-emitting chips of different light-emitting colors, the LED light-emitting chips comprising A poles and Bpoles with opposite polarities; At least one LED light-emitting chip in each pixel unit is a dual-electrode chip, and A pole and B pole of that dual-electrode chip are positioned on the same surface of the dual-electrode chip; In all pixel cells, the direction of the A-to B-pole connection of the two electrode chips of the same light emitting color points in the same direction. The LED display unit group provided by the invention can improve the fixing efficiency and ensure the positional accuracy of the chip by pointing to the same direction of the A-to-B-pole connection line of the double-electrode chip with the same light-emitting color.

The invention discloses a die bonding device of a die bonder and a working method thereof. The device comprises a device rack, a die bonding base, a horizontal moving mechanism, a vertical moving mechanism and a die bonding welding mechanism. A die bonding table is arranged on the device rack. A die bonding base is fixedly mounted on the die bonding table. A die bonding moving mechanism is fixedlymounted on the die bonding base. The die bonding base is connected to the die bonding moving mechanism. The die bonding base comprises a mounting bottom plate, a die bonding base plate and a hinge. Alimiting block and a supporting plate are arranged on the mounting bottom plate, the die bonding base plate is connected to the supporting plate, a positioning cover plate is rotatably connected to the die bonding base plate through the hinge, and a handle is arranged on the die bonding base plate. The replacement of the wafer is slow, the die bonding mechanism cannot move to influence the die bonding efficiency of the LED wafer, and the LED wafer processing mechanism is single and poor in universality, so that the production and processing cost of the LED wafer is improved.

The invention discloses a die bonding method and terminal. The die bonding method comprises the steps of respectively obtaining first image information of at least two wafers to be bonded; respectively calculating the coordinate deviation of the wafers to be bonded according to the first image information and reference points of the wafers to be bonded; adjusting the at least two wafers to be bonded according to the coordinate deviation of the wafers to be bonded and the die bonding reference points; respectively obtaining second image information of at least two die bonding positions; respectively calculating the coordinate deviation of the die bonding positions according to the second image information and die bonding position reference points; adjusting the at least two die bonding positions according to the coordinate deviation of the die bonding positions and the die bonding reference points; and bonding the at least two adjusted wafers to be bonded at the at least two adjusted die bonding positions. The die bonding method can greatly improve the die bonding efficiency and die bonding accuracy, and is applicable to carrying out batch die bonding on Mini LEDs.

The present invention discloses a crystal ring device including a bracket, a first driving mechanism for driving the bracket to move in an X-axis direction, a second driving mechanism for driving thebracket to move in a Y-axis direction, and three fixing mechanisms for fixing a crystal ring. The three fixing mechanisms are spaced apart on the bracket, the fixing mechanism includes rotating members, fixing members for fixing the crystal ring and third driving components for driving the rotating members to rotate for 360 degrees, and the fixing members are fixedly arranged on the rotating members. According to the crystal ring device, three chips of different colors can be fixed on the same piece of equipment at the same time, the crystal fixation efficiency is high, the switching of materials between machines is not needed, the time can be saved, and the crystal fixation quality can be improved.