A LED high-speed crystal-bonding equipment and its automatic loading and unloading device
A technology of crystal bonding and equipment, applied in the field of LED high-speed crystal bonding equipment and its automatic loading and unloading device, can solve the problems of low LED preparation efficiency and affecting LED output, so as to improve the actual application effect, improve the crystal bonding efficiency, increase the Effect of degree of particle dispersion
A technology of crystal bonding and equipment, applied in the field of LED high-speed crystal bonding equipment and its automatic loading and unloading device, can solve the problems of low LED preparation efficiency and affecting LED output, so as to improve the actual application effect, improve the crystal bonding efficiency, increase the Effect of degree of particle dispersion
CN112436084BActive Publication Date: 2021-09-07YANCHENG DONGSHAN PRECISION MANUFACTURING CO LTD
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[0030] As an embodiment of the present invention, the rotating rod 53 is twisted between the two groove walls of the rectangular groove 51 through a torsion spring 52; blades 54 are fixedly connected to the outer wall of the rotating rod 53; the blades 54 are evenly distributed On the outer wall of the rotating rod 53; the middle part of the rotating rod 53 is wound with a wire rope 55; the wire rope 55 is in a tightened state under the action of the torsion spring 52, and the other end of the wire rope 55 is connected to the injection plate 45 When working, one of the No. 1 motors 31 drives the injection plate 45 away from the dispensing plate 5, and the injection plate 45 will pull the wire rope 55 to move, so that the rotating rod 53 moves along the wire rope 55. When the two groove walls of the rectangular groove 51 rotate, the rotation of the rotating rod 53 will drive the blade 54 to rotate, thereby stirring the adhesive in the rectangular groove 51 through the blade 54, ...
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The present invention relates to the technical field of crystal-bonding equipment, specifically a LED high-speed crystal-bonding equipment and an automatic loading and unloading device thereof. The LED high-speed crystal-bonding equipment includes a wafer console and a fixture console; The crystal expansion ring is clamped; the upper end of the crystal expansion ring is wrapped with a blue film; the blue film is provided with chips; the chips are evenly distributed on the upper end of the blue film; the LED high-speed crystal bonding equipment in the present invention passes through it A No. 1 motor drives the corresponding movement of the screw slider, and the No. 1 electric push rod drives the injection unit to move, thus completing the dispensing process, and then drives the corresponding screw slider through another No. 1 motor. The sub-movement of the block cooperates with the movement of the injection unit driven by the No. 2 electric push rod, thereby completing the process of placing the core, so that the present invention can fix multiple chips at the same time, thereby realizing the effect of performing multiple solid crystals at the same time, and then The crystal-bonding efficiency of the LED is improved, so that the production efficiency of the LED is improved.
Description
technical field [0001] The invention relates to the technical field of crystal-bonding equipment, in particular to LED high-speed crystal-bonding equipment and an automatic loading and unloading device thereof. Background technique [0002] Light-emitting diodes are referred to as LEDs; they are made of compounds containing gallium, arsenic, phosphorus, nitrogen, etc.; when electrons and holes recombine, they can radiate visible light, so they can be used to make light-emitting diodes; they are used as indicator lights in circuits and instruments , or to form a text or digital display; solid crystal is also called Die Bond or chip loading; solid crystal is to bond the chip to the designated area of ββthe bracket through an adhesive to form a thermal path or an electrical path for the subsequent wiring connection The process of providing conditions; the existing LED is solidified by a crystal bonder; the LED crystal bonder is a professional model for solid crystal of LED prod...
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Patent Timeline
07 Sep 2021
Publication
CN112436084B
- IPC
- H01L33/48; H01L21/67; H01L21/677
- CPC
- H01L21/67092; H01L21/67742; H01L33/48
- Inventors
- ιε; ιΉθ΄