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Double arm crystal ring changing mechanism

A double-arm type and handling arm technology, applied in the field of double-arm type crystal ring exchange mechanism, can solve the problems of low feeding and unloading efficiency of crystal rings, affecting the efficiency of die bonding, etc., to increase the speed, reduce the waiting time, and improve the efficiency of die bonding Effect

Active Publication Date: 2021-11-05
SHENZHEN XINYICHANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the embodiment of the present application is to provide a double-arm crystal ring exchange mechanism to solve the problem in the related art: the loading and unloading operations of the crystal ring are all completed by the same mechanical arm, which leads to the efficiency of loading and unloading of the crystal ring. Low, which affects the efficiency of die bonding

Method used

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Embodiment Construction

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0034] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specify...

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Abstract

The present application provides a double-armed crystal ring exchange mechanism, including a first transport arm; a second transport arm; The second transport arm reciprocates between the crystal ring upper material level and the crystal ring lower material level. The present application can move the crystal ring containing the wafer on the crystal ring upper material level to the crystal ring lower material level through the first transport arm, so that the wafer on the crystal ring can be ejected by the crystal lifting mechanism; The used crystal ring is taken out at the lower material level of the ring, which is convenient for the first conveying arm to load the crystal ring; the first conveying arm and the second conveying arm can be driven by the conveying drive unit to the material level of the crystal ring and the crystal ring unloading Move back and forth between bits. In this way, the loading operation of the crystal ring can be completed by the first conveying arm, and the unloading operation of the crystal ring can be completed by the second conveying arm, thereby helping to improve the speed of loading and unloading the crystal ring and reducing the waiting time for loading and unloading the crystal ring , thereby improving the die-bonding efficiency.

Description

technical field [0001] This application belongs to the technical field of crystal bonding, and more specifically relates to a double-armed crystal changing ring mechanism. Background technique [0002] In the crystal bonding equipment, the crystal ring containing the wafer needs to be moved to the crystal ring rotating platform through the mechanical arm, and then the wafer is ejected by the crystal lifting mechanism, and the ejected wafer is moved to the bonding position by the suction nozzle to realize the Die-bonding operation of the bracket. [0003] However, when the crystal ring on the crystal ring rotating platform needs to be replaced, the used crystal ring is usually removed by the mechanical arm, that is, the loading and unloading operations of the crystal ring are all completed by the same mechanical arm, which leads to the The loading and unloading efficiency of the ring is low, which in turn affects the die bonding efficiency. Contents of the invention [00...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65G47/90B65G47/82
CPCB65G47/82B65G47/90
Inventor 梁志宏
Owner SHENZHEN XINYICHANG TECH CO LTD
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