A kind of LED continuous crystal bonding device and its crystal bonding method
A LED chip and solid crystal technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the unseen problems involving continuous SiC free thin film ceramic heat dissipation substrates, etc.
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[0068] In order to make the purpose, technical solutions and advantages of the present invention more clear and understandable, the present invention will be described below in conjunction with exemplary embodiments and with reference to the accompanying drawings.
[0069] This kind of LED continuous crystal bonding device provided by the present invention, such as figure 1 As shown, it includes: a substrate film delivery system 1 , a transmission system 2 , a dispensing system 3 , a crystal bonding system 4 , a heating system 5 and a substrate film delivery system 6 . The substrate film-out system 1 includes a silicon carbide thin film substrate 10 to be solidified, a substrate reel 11 , a rotating motor 12 and a support 13 . In the transmission system 2 , it includes a positioning track 21 located at the front end of the conveyor belt 22 , a high temperature resistant rubber conveyor belt 22 , a motor 23 , a control panel 24 for rotation speed, and supporting legs 25 . The ...
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