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Preparation method of LED lamp bead with built-in drive IC

A technology of LED lamp beads and light-emitting chips, which is applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems that affect the welding quality of light-emitting chips, and the position of the driver IC is difficult to fix, so as to improve the efficiency of die-bonding and accurate positioning , the effect of reducing the error

Inactive Publication Date: 2020-11-13
SHENZHEN NEXNOVO TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to overcome the problem that the fixed position of the driver IC is difficult to fix when the driver IC is bonded in the prior art, and the error caused by machine error or heating affects the welding quality of the light-emitting chip on the driver IC, the present invention provides a built-in Preparation method of LED lamp bead for driver IC

Method used

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  • Preparation method of LED lamp bead with built-in drive IC
  • Preparation method of LED lamp bead with built-in drive IC
  • Preparation method of LED lamp bead with built-in drive IC

Examples

Experimental program
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Effect test

Embodiment

[0068] This example will specifically describe the preparation method of the LED lamp bead with a built-in driver IC provided by the present invention. The LED lamp bead in this example may adopt a CHIP structure or a TOP structure. The so-called TOP structure refers to the structure in which PLCC (full name in Chinese: plastic chip carrier with leads; full name in English: Plastic Leaded Chip Carrier) plastic bracket is used as the base bracket 1, and the pins of the PLCC plastic bracket packaging structure (not shown in the figure) out) bend inward at the bottom. The process is well known to the public, and generally includes metal strip punching, electroplating, PPA (polyphthalamide) injection molding, bending, five-sided three-dimensional inkjet and other processes. Its core is to form a chip mounting surface through a metal strip on the surface of the plastic bracket; and pins are extended from the chip mounting surface and bent inward at the bottom and then attached to t...

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Abstract

The invention provides a preparation method of an LED lamp bead with a built-in drive IC; and aims to solve the problems that in the prior art, when a drive IC is subjected to die bonding, the position of the drive IC is difficult to fix, errors are caused by machine errors or heating, and the welding quality of a light-emitting wafer on the drive IC is affected. According to the preparation method, the drive IC is formed on a drive wafer, the drive IC is not cut into single drive ICs, instead, batch of light-emitting wafers are inversely arranged on the drive wafer on which the drive IC is manufactured; thus, bonding pads on the drive IC can be positioned more accurately, errors are reduced, the welding quality of the light-emitting wafers on the drive IC is guaranteed, meanwhile, the diebonding efficiency of the light-emitting wafers can be improved through the batch inversion mode, and the manufacturing cost is reduced.

Description

technical field [0001] The invention relates to a method for preparing an LED lamp bead, in particular to a method for preparing an LED lamp bead with a driver IC. Background technique [0002] Transparent LED displays have gradually been widely used in the market, and various product forms have been developed. A transparent LED display technology that distributes LED lamp beads in an array on a transparent substrate has begun to appear. At present, as a better solution, there is a structure in which the driver chip is built into the LED lamp bead; this structure can simplify the line connection and improve the efficiency of the circuit design. This kind of LED lamp bead with the driver chip is often used in The LED light strip is brightened and on the LED display. [0003] As a way to further optimize, such as Figure 1a As shown, taking the TOP-type packaged LED lamp bead as an example, the LED lamp bead with built-in driver IC2 includes a base bracket 1 on which the dri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L25/16H01L25/00H01L33/48H01L33/62
CPCH01L25/0753H01L25/167H01L25/50H01L33/48H01L33/62
Inventor 李淑玲
Owner SHENZHEN NEXNOVO TECH CO LTD
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