COB die bonder

Abstract

The invention provides a COB die bonder. The die bonder comprises a support, a die bonding table, wafer disc conveying mechanisms and swing arms, wherein the die bonding table and the wafer disc conveying mechanisms are respectively arranged on the support, the two wafer disc conveying mechanisms are respectively positioned on two sides of the die bonding table, the two swing arms are respectivelypositioned between the die bonding table and the wafer disc conveying mechanisms, the swing arms are provided with Z-axis motors of which the position can be adjusted up and down, one end of each swing arm is a rotating end, the other end of each swing arm is a wafer grabbing and fixing end, the rotating end of each swing arm is correspondingly connected with a swing arm driving motor, and the swing arm driving motors drive the wafer grabbing ends of the swing arms to reciprocate between the wafer disc conveying mechanisms and the wafer fixing table. The die bonding table is advantaged in that the two swing arms are matched with the two wafer disc conveying mechanisms to carry out die bonding on the die bonding table together so that the die bonding production takt is improved, and die bonding efficiency is improved.

Description

technical field [0001] The invention relates to a crystal bonder, in particular to a COB crystal bonder. Background technique [0002] COB technology is an emerging LED packaging technology, which is different from the traditional SMD positive packaging technology. It is a flip-chip technology that directly solders the light-emitting chip to the PCB. As the size of LED wafers becomes smaller, the number of lamp beads in the same PCB area increases, and the die bonding needs to be completed as soon as possible after brushing the solder paste. However, the existing die bonding devices either have low die bonding efficiency or double swing arms. It is difficult to meet the process requirements of the above-mentioned veneer for the dual die-bonding station. Contents of the invention [0003] In order to solve the problems in the prior art, the present invention provides a COB crystal bonding machine with high crystal bonding efficiency. [0004] The present invention provide...

AI Technical Summary

Problems solved by technology

As the size of LED wafers becomes smaller, the number of lamp beads in the same PCB area increases, and the die bonding needs to be completed as soon as possible after brushing the solder paste. However, the existing die bonding devices either have low die bonding efficiency or double swing arms. It is difficult to meet the process requirements of the above-mentioned veneer for the dual solid crystal table

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