Continuous die bonding device and die bonding method of light emitting diode (LED)

Abstract

The invention provides a continuous die bonding device and die bonding method of a light emitting diode (LED), and relates to package of an LED chip. The device is provided with a substrate film sending system, a transmission system, a dispersion glue system, a die bonding system, a heating system and a substrate film outlet system, wherein substrate film sending system, a transmission system, the dispersion glue system, the die bonding system, the heating system and the substrate film outlet system are sequentially arranged on a ground surface. The die bonding method comprises the steps of installing the substrate film sending system and the transmission system, and transmitting a substrate by the substrate film sending system and the transmission system; performing dispersion glue on the substrate by the dispersion glue system; performing LED die bonding on the substrate by the die bonding system; curing silver glue by the heating system; and firmly pasting the LED chip on the substrate. By the device and the die bonding method, a high-quality continuous silicon carbide ceramic substrate package product can be obtained, continuous and automatic die bonding of the LED chip on a board of the continuous silicon carbide thin film substrate and industrial production of the package product are achieved, and an LED finished device with more excellent performance is obtained.

Description

technical field [0001] The invention relates to LED chip packaging, in particular to an LED continuous crystal bonding device and a crystal bonding method thereof. Background technique [0002] As a semiconductor device with excellent performance, LED (Light Emitting Diode) has the characteristics of small size, high brightness, long life, energy saving and environmental protection. In recent years, the output power of LED chips has continued to increase. For power LED semiconductor devices, high-power integrated design and small-volume complex structures will accumulate a lot of heat in a short period of time, directly accelerating the decline in the quantum yield of phosphor powder and device aging. Shorten the service life of the device, and even cause the chip to fail. In order to more effectively export the heat generated by the LED, it is necessary to use heat dissipation materials with high thermal conductivity and low thermal resistance, and adopt a reasonable packa...

AI Technical Summary

Problems solved by technology

[0007] Chinese patent CN106024647A discloses a low-cost production process of COB packaged devices. The existing support is replaced by the PCB board patterning process, which saves the cost of mold opening and improves efficiency and flexibility. However, it is only suitable for large plates of metal or Ceramic substrate

[0011] At present, there is no LED die-bonding device or die-bonding method involving continuous SiC free thin-film ceramic heat dissipation substrates in China.

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