Die bonder

Abstract

The invention provides a die bonder which comprises the components of a wafer supply mechanism which comprises a wafer ring which is provided with a wafer supply position for supplying a wafer; the rotating mechanism comprises a rotating disc, the rotating disc is rotationally arranged on one side of the wafer ring, and the rotating plane of the rotating disc is perpendicular to the wafer ring; the bearing mechanism comprises a substrate, the substrate is arranged on one side of the turntable, a wafer fixing position for fixing a wafer is arranged on the substrate, and the substrate is perpendicular to the rotating plane of the turntable; the pick-and-place mechanism comprises a wafer suction nozzle, and the wafer suction nozzle is arranged on the turntable and used for sucking the wafer; according to the die bonder provided by the invention, two actions of die taking and die bonding can be realized in one period of rotation of the turntable, and the die bonding efficiency can be improved.

Description

technical field [0001] The present application relates to the technical field of crystal bonding, in particular to a high-precision and high-speed crystal bonding machine. Background technique [0002] The crystal-bonding process of the existing crystal-bonding machine is as follows: the thimble mechanism lifts the specified wafer from the wafer film, and then the crystal-bonding swing arm rotates to the top of the specified wafer (the crystal-bonding swing arm generally rotates 180°, One rotation cycle takes 180ms), first move down to pick up the wafer, then move up to lift the wafer, and then rotate to transport the wafer to the designated bonding position on the pad. During the entire die bonding process, the die bonding swing arm needs to rotate and move downwards and upwards to fix a chip to a specified position on the pad. Such a die bonding machine has slow die bonding speed and low die bonding efficiency. Die bonding 20000 pieces / h; and using such a die bonding mach...

AI Technical Summary

Problems solved by technology

During the entire die bonding process, the die bonding swing arm needs to rotate and move downwards and upwards to fix a chip to a specified position on the pad. Such a die bonding machine has slow die bonding speed and low die bonding efficiency. Die bonding 20000 pieces / h; and using such a die bonding machine, when picking up a chip on a large-sized wafer tray, or when placing the picked-up chip on a large-sized pad by the die-bonding swing arm, it is necessary to Increasing the length of the die-bonding swing arm can pick up or place the chip smoothly, and increasing the length of the die-bonding swing arm will undoubtedly increase the weight of the die-bonding swing arm, and increasing the weight of the die-bonding swing arm will definitely increase the movement of the die-bonding swing arm. The amount of inertia will reduce the stability of the die-bonding swing arm movement, and ultimately affect the speed of die-bonding and the accuracy of wafer placement

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