Bond head structure of 180-degree die bonder

Abstract

A bond head structure of a 180-degree die bonder comprises a driving device and a swing arm mechanism, wherein the driving device comprises a Z-axis motor and a rotating motor; the Z-axis motor is arranged on a Z-axis installing seat; a motor shaft of the Z-axis motor is connected with an eccentric shaft through a bearing; the eccentric shaft is connected with a connecting rod; the connecting rodis connected with a Z-axis connecting block; a motor shaft of the rotating motor is connected with a rotating shaft; the rotating shaft is provided with a swing arm guide rail; the swing arm guide rail is provided with a swing arm connecting block in a clamping way; the swing arm connecting block is rotationally connected with the Z-axis connecting block through a fixed shaft and is locked througha nut; the swing arm mechanism is fixedly connected with the swing arm connecting block; the rotating motor drives the swing arm mechanism to swing within a 180-degree range. According to the bond head structure disclosed by the invention, a flexible swing arm structure is adopted, the stress of a swing arm can be regulated, and the flexibility of the swing arm can be increased; due to the designof the bond head structure of the 180-degree die bond, the die bonding speed can be increased while the layout of effectively reducing the volume of a bond head zone and optimizing all components iscarried out.

Description

technical field [0001] The invention relates to a bonding head structure used in LED crystal bonding machines, in particular to a bonding head structure capable of realizing 180° high-speed movement. Background technique [0002] At present, the domestic LED industry continues to develop, and die bonding is one of the most critical processes in the manufacture of LED devices. Therefore, the requirements for the productivity and efficiency of LED die bonding machines are getting higher and higher. The process of LED crystal solidification includes: first, apply silver glue or insulating glue on the LED bracket, and then use the swing arm device to bond the LED chip to the relevant position of the bracket through vacuum adsorption. During this process, the swing arm device needs to perform high-frequency, reciprocating, and short-distance movements. Whether the structure of the swing arm can meet the requirements of high-speed and high-precision die bonding has become an impor...

AI Technical Summary

Problems solved by technology

[0003] Aiming at the current problems of low working efficiency, processing accuracy and reliability of LED chip bonding, improving the structure of the bonding machine and developing a swing arm structure suitable for high-frequency and high-precision processing has become an important direction for the research and development of LED bonding machines.

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