Die bonder detection mechanism and continuous detection method

Abstract

The invention is applied to the technical field of semiconductor die bonding and discloses a die bonder detection mechanism and a continuous detection method. The die bonder detection mechanism comprises a translation motor disposed on a frame. The rotation shaft of the translation motor is connected with a rotation welding arm connection seat; the rotation welding arm connection seat is provided with four welding arms; each welding arm is provided with a wafer suction nozzle; a reflective mirror is arranged right below the wafer suction nozzles below the rotation welding arm connection seat; one side of the reflective mirror is provided with a camera connected with a control module; the wafer suction nozzles are disposed right above the reflective mirror during detection; and a wafer image reflected by the reflective mirror shares the same optical axis with the camera. During working, at least one wafer is disposed at a die bonding position, and the other wafer is disposed at a detection position. Since the other wafer is detected at the time of die bonding, the two processes of detection and die boding can be simultaneously carried out on the two wafers, i.e., when die bonding is performed on one wafer, the other wafer is detected so that the problem of long time for solidifying a unit amount of wafers when detection is performed first and die bonding is performed afterwards can be avoided, and the die bonding efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor crystal bonding, in particular to a detection mechanism and a continuous detection method of a crystal bonding machine. Background technique [0002] When the semiconductor crystal bonding device is in operation, it is necessary to transport the materials for the crystal bonding to the corresponding position through the feeding device, and then the crystal, such as the LED wafer, is moved to the corresponding position of the substrate by the robot for fixing. The semiconductor die-bonding device needs to detect the position of the wafer before welding the wafer to the substrate. [0003] The existing one usually only has one welding arm and welding head. When working, the position of the wafer is detected first, and the wafer is fixed when the position meets the requirements. Since the bonding and detection cannot be carried out simultaneously, the process time is extended , thereby reducin...

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Problems solved by technology

[0003] The existing one usually only has one welding arm and welding head. When working, the position of the wafer is detected first, and the wafer is fixed when the position meets the requirements. Since the bonding and detection cannot be carried out simultaneously, the process time is extended , thereby reducing production efficiency

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