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Die bonding mechanical arm and die bonding equipment

A robotic arm and die-bonding technology, applied in conveyor objects, semiconductor/solid-state device manufacturing, semiconductor devices, etc., can solve the problem of lack of high-efficiency die-bonding solutions, and achieve the effect of high die-bonding efficiency

Active Publication Date: 2021-10-22
SHEN ZHEN TALUER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention provides a crystal-bonding robot arm and crystal-bonding equipment to solve the lack of a feasible crystal-bonding solution with high crystal-bonding efficiency in the prior art question

Method used

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  • Die bonding mechanical arm and die bonding equipment
  • Die bonding mechanical arm and die bonding equipment
  • Die bonding mechanical arm and die bonding equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] In this example, if figure 1 and figure 2 As shown, the die bonding robotic arm 10 includes a base 11 and a first driving mechanism. The first driving mechanism is used to drive the substrate 11 to move between the wafer plate 20 for placing the wafer and the stage 30 for placing the target substrate. A plurality of die bonding heads 110 are arranged on the substrate 11 , and the plurality of die bonding heads 110 are arranged in m rows and n columns; wherein, m≧1, n≧2, and m and n are integers. Each die-bonding head 110 includes a lifting mechanism and a suction nozzle. The suction nozzle is arranged on the lifting mechanism. The lifting mechanism is used to drive the suction nozzle to lift up and down. The suction nozzle can suck the wafer.

[0036] The above-mentioned die-bonding robotic arm provided in this embodiment has a plurality of die-bonding heads 110 arranged on the substrate 11, and the plurality of die-bonding heads 110 are arranged in an array form of ...

Embodiment 2

[0043] In this embodiment, the slide rails provided on the mounting frame 40 are different from the above-mentioned Embodiment 1. Specifically, refer to image 3 and Figure 4 , the mounting frame 40 is provided with a first-level slide rail extending along the first direction (not shown in the figure, blocked by the sliding platform 401), the first-level slide rail is provided with a sliding platform 401, and the sliding platform 401 is provided with a sliding platform 401 extending along the first direction. Secondary sliding rails extending in two directions (not shown in the figure, covered by the mounting plate 111 ). The base body 11 includes a mounting plate 111 disposed on the secondary slide rail and capable of sliding along the secondary slide rail. The first driving mechanism is connected with the mounting plate 111 and is used to drive the mounting plate 111 to move along the secondary slide rail, and drive the sliding platform 401 to move along the primary slide ...

Embodiment 3

[0059] In this embodiment, it is different from the above-mentioned embodiment 1 and embodiment 2, such as Figure 5 As shown, the crystal bonding equipment further includes a second image acquisition device 60, and each crystal bonding head 110 of the crystal bonding robotic arm also includes a rotating mechanism.

[0060] The second image acquisition device 60 is used for acquiring images of the sucked wafers after the wafers are picked up by the suction nozzles. Specifically, the image collection mechanism may be a CCD camera, etc., and the images collected by it may be static photos, dynamic video information, or real-time video surveillance images. According to the images collected by the image acquisition mechanism, after the suction nozzle picks up the wafer, the angle presented by the sucked wafer on the suction nozzle can be judged, and the angle can be evaluated to determine whether the angle of the wafer can be accurately aligned and mounted on the suction nozzle. ...

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Abstract

The invention relates to a die bonding mechanical arm and die bonding equipment. The die bonding mechanical arm comprises a base body and a first driving mechanism, and the first driving mechanism is used for driving the base body to move between a wafer disc used for placing wafers and a carrying table used for placing a target substrate; the substrate is provided with a plurality of die bonding heads, and the plurality of die bonding heads are arranged in m rows and n columns. Each die bonding head comprises a lifting mechanism and a suction nozzle, the suction nozzle is arranged on the lifting mechanism, and the suction nozzle can suck a wafer, pick and place the wafer and fix the wafer on the die bonding head. According to the die bonding mechanical arm, a plurality of wafers can be taken from the wafers placed on the wafer disc at the wafer disc at a time and temporarily stored on the plurality of die bonding heads, the plurality of wafers temporarily stored on the plurality of die bonding heads are transferred and installed on the target substrate placed on the carrying table at a time, and die bonding efficiency is high; moreover, the improvement of the die bonding efficiency is not realized by purely depending on the increase of the number of the die bonding mechanical arms, and the upper limit of the die bonding efficiency is higher.

Description

technical field [0001] The invention relates to the field of crystal bonding of semiconductor wafers, in particular to a crystal bonding robot arm and crystal bonding equipment comprising the crystal bonding robot arm. Background technique [0002] The die bonder is the key equipment in the LED packaging production line. Its function is to transfer and install the LED chips on the wafer to the LED chip installation position on the LED board (such as Mini LED display panel or Micro LED display panel). [0003] Existing crystal bonders mainly include a stage, a wafer plate and a swing arm. Wherein, the stage is used to place the substrate, such as an LED board on which LED chips need to be installed. The wafer tray is used to place wafers, such as wafers with red LED chips, wafers with green LED chips, wafers with blue LED chips, etc. The swing arm can reciprocate between the wafer tray and the carrier. At the wafer tray, the swing arm takes the wafers from the wafer to the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/683H01L33/48
CPCH01L33/48H01L21/67739H01L21/6838H01L2933/0033
Inventor 邓应铖曾逸
Owner SHEN ZHEN TALUER TECH CO LTD
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