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Die bonder

A die-bonding machine and die-bonding technology, which is applied to conveyor objects, semiconductor/solid-state device manufacturing, electrical components, etc., and can solve the problems of slow loading and unloading of crystal rings, low suction nozzle efficiency, and impact on die-bonding efficiency.

Active Publication Date: 2021-06-08
SHENZHEN XINYICHANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiment of the present application is to provide a crystal bonding machine to solve the problems existing in the related art: the efficiency of manually replacing the suction nozzle is low, and the loading and unloading rate of the crystal ring is slow, which affects the efficiency of the crystal bonding

Method used

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Embodiment Construction

[0050] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0051] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0052]In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifyi...

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Abstract

The invention provides a die bonder. The die bonder comprises a rack, a support feeding assembly, a support transferring assembly, a crystal ring feeding assembly, a crystal ring rotating assembly, a crystal jacking assembly, a crystal ring transferring assembly, a suction nozzle, a wafer fixing swing arm assembly, a suction nozzle receiving and feeding assembly and a material receiving assembly. A support can be supplied to the support transferring assembly through the support feeding assembly, a crystal ring on the crystal ring feeding assembly can be transferred to the crystal ring transferring assembly through the crystal ring transferring assembly, the used crystal ring on the crystal ring rotating assembly is removed, and a wafer on the crystal ring can be ejected to a wafer supply position through the wafer ejecting assembly. The wafer at the wafer supply position can be transferred to the support transferring assembly through the suction nozzle and the wafer fixing swing arm assembly, and wafer fixing operation of the wafer and the support is completed. The synchronous operation of feeding and discharging of the crystal ring can be realized through the crystal ring transferring assembly, the waiting time of feeding and discharging of the crystal ring is reduced, and the improvement of the die bonding efficiency is facilitated. Moreover, the suction nozzle can be automatically replaced through the suction nozzle receiving and supplying assembly, time and labor are saved, and the efficiency is high.

Description

technical field [0001] This application belongs to the technical field of crystal bonding, and more specifically relates to a crystal bonding machine. Background technique [0002] In the die-bonding equipment, the wafer is usually transported from the die-supply position to the die-bonding position by the suction nozzle, so as to realize the die-bonding operation of the die and the support. For different wafers, different types of nozzles need to be used for adsorption. However, at present, the suction nozzle is usually replaced manually, which is inefficient. Moreover, the operation of placing the crystal ring containing the wafer on the crystal supply position and removing the used crystal ring from the crystal supply position is completed by the same mechanical arm, which leads to slow loading and unloading of the crystal ring. , thus affecting the die bonding efficiency. Contents of the invention [0003] The purpose of the embodiment of the present application is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/683H01L21/67
CPCH01L21/67144H01L21/67766H01L21/67775H01L21/67778H01L21/6838
Inventor 胡新平
Owner SHENZHEN XINYICHANG TECH CO LTD
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