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LED chip unit and LED device, and manufacturing methods thereof

A technology for LED chips and LED devices, applied in electrical components, semiconductor devices, circuits, etc., can solve the problems of product quality and reliability decline, low LED chip bonding efficiency, etc., to improve the bonding efficiency, quality and reliability. performance, cost reduction

Pending Publication Date: 2021-06-29
SHENZHEN JUFEI OPTOELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides an LED chip unit, an LED device and a manufacturing method thereof, which solves the problem that the existing LED chips have low die-bonding efficiency, resulting in a decrease in product quality and reliability

Method used

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  • LED chip unit and LED device, and manufacturing methods thereof
  • LED chip unit and LED device, and manufacturing methods thereof
  • LED chip unit and LED device, and manufacturing methods thereof

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Embodiment Construction

[0048] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below through specific implementation manners in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0049]This embodiment provides a method for making an LED chip unit. The prepared LED chip unit consists of at least two Micro LED chips or Mini LED chips (it should be understood that it can also be an ordinary-sized LED chip or a large-sized LED chip. chip) composed of LED chip units, the LED chip unit obtained by the manufacturing method of the LED chip unit provided in this embodiment can make it possible to directly place multiple LED chip units at a time in the process of bonding LED chips The LED chip is transferred to the corresponding position on ...

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Abstract

The invention provides an LED chip unit and an LED device, and manufacturing methods thereof. Flip LED chips are arranged on the front surface of an adhesive film according to the distribution of corresponding chip electrode bonding pads on a substrate, and an adhesive layer which covers and packages the flip LED chips together is formed on the front surface of the adhesive film; and the adhesive layer is cut to obtain a plurality of LED chip units, each LED chip unit comprises at least two LED flip chips, and the LED flip chips are correspondingly distributed according to the distribution of corresponding chip electrode bonding pads on the substrate. When the LED chip unit is used for manufacturing the LED device, the LED chip unit comprising a plurality of LED chips can be transferred to the substrate, and the positive electrode and the negative electrode of each LED chip in the LED chip unit are electrically connected with the corresponding chip electrode bonding pads on the substrate respectively, so the die bonding efficiency of the LED chip can be multiplied, and the viscisity and the conductivity of elargol and solder paste printed on the bonding pad of the substrate are prevented from becoming poor due to long die bonding time, and the quality and the reliability of an LED device product are improved.

Description

technical field [0001] The present invention relates to the field of LED (Light Emitting Diode, light emitting diode), in particular to an LED chip unit, an LED device and a manufacturing method thereof. Background technique [0002] The application of Mini Mini LED should be more and more extensive. For example, video quality directly affects people's emotions and quality of life, and ultra-high-definition video 8K is the future development direction. Mini LED and Micro LED can be used as backlight or direct display, which complies with the development requirements of ultra-high-definition video. At present, the Mini LED die-bonding method is to use a die-bonding machine (mass transfer machine) to place flip-chip LED chips one by one on the pads printed with silver glue or solder paste, and bake (silver glue) or reflow soldering after mounting. (solder paste). For example, the 11-inch RGB direct display screen uses flip-chip LED chips. The number of chips required for a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/56H01L33/62H01L33/00
CPCH01L33/48H01L33/56H01L33/62H01L33/005
Inventor 孙平如苏宏波
Owner SHENZHEN JUFEI OPTOELECTRONICS
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