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Chip Automatic Correction Type Die Bonder

A die-bonding machine and chip technology, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, circuits, etc., can solve the problems of chip position deviation, affecting the die-bonding precision, etc., and achieve the effect of improving the die-bonding precision

Active Publication Date: 2021-06-18
SHENZHEN XINYICHANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiment of the present application is to provide an automatic chip correction type die bonding machine to solve the problem in the related art that the position of the chip will be shifted when it is ejected by the thimble, which will affect the accuracy of the die bonding

Method used

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  • Chip Automatic Correction Type Die Bonder
  • Chip Automatic Correction Type Die Bonder
  • Chip Automatic Correction Type Die Bonder

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Embodiment Construction

[0042] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

[0043] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0044] In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicit...

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Abstract

The application provides a chip automatic correction type crystal bonding machine, including a frame, and a feeding mechanism, a clamp mechanism, a crystal feeding mechanism, a rotating swing arm mechanism, a camera mechanism, a solid crystal camera lens and Take the crystal camera lens. The rotating swing arm mechanism includes a rotating seat, a suction nozzle, a support arm supporting the suction nozzle, a rotary driver for driving the support arm to rotate horizontally so that the suction nozzle reciprocates through the crystal fixation position and the crystal supply position, and is used to drive the suction nozzle to rotate to correct Adjustment unit for chip position. In this application, a camera mechanism is set between the crystal-fixing position and the crystal-supplying position. When the rotary driver drives the support arm and the suction nozzle to reciprocate through the crystal-fixing position and the crystal supplying position, the camera mechanism can obtain the position information of the chip on the suction nozzle. If the position of the chip picked up by the suction nozzle is shifted, the camera mechanism captures that the chip is not in the correct position. At this time, the adjustment unit drives the suction nozzle to rotate, and then the position of the chip can be corrected, thereby improving the die bonding accuracy of the die bonder.

Description

technical field [0001] This application belongs to the technical field of crystal bonding equipment, and more specifically relates to a chip automatic correction type crystal bonding machine. Background technique [0002] Die bonding generally uses a glue dispenser to dispense glue on the position where the chip is installed on the bracket, and then the bracket is moved to the die bonding position. The die bonding swing arm picks up the chip from the chip feeding platform, and then places the chip on the bracket to achieve Solid crystal. However, the chip feeding platform is usually ejected by ejector pins, and the position of the chip will shift due to vibration during the ejection process, which will affect the die bonding accuracy. Contents of the invention [0003] The purpose of the embodiment of the present application is to provide an automatic chip correction type die bonder to solve the problem in the related art that the position of the chip will be shifted when...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67144H01L21/67259
Inventor 胡新荣
Owner SHENZHEN XINYICHANG TECH CO LTD
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