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Electronic apparatus

A technology for electronic equipment and keyboard devices, which is applied to the structural parts, circuits, and electrical components of electrical equipment, etc., can solve the problems of obstructing the thinning of the main body shell and the difficulty of thinning the main body shell.

Active Publication Date: 2019-02-01
LENOVO PC INT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the structure in which the substrate and the CPU are arranged at positions overlapping with the lower part of the keyboard device as in the above-mentioned conventional structure, the above-mentioned laminated portion has a considerable thickness, which hinders the thinning of the main body case.
In addition, in the case of the structure in which the heat pipe for heat dissipation of the CPU passes through the bottom of the keyboard device, the thickness of the heat pipe is also stacked, so it is more difficult to reduce the thickness of the main body case.

Method used

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Embodiment Construction

[0030] Hereinafter, the electronic device of the present invention will be described in detail with reference to the accompanying drawings by citing suitable embodiments.

[0031] figure 1 It is a top view of the electronic device 10 which concerns on one Embodiment of this invention. In this embodiment, the electronic device 10 that is a notebook computer is exemplified.

[0032] like figure 1 As shown, the electronic device 10 includes a main body case 14 in which a keyboard device 12 and a touch panel 13 are provided, and a display case 18 in which a display 16 is provided. The display case 18 is rotatably connected to the rear end portion 14 a of the main body case 14 via a pair of left and right hinges 20 , 20 .

[0033] figure 1 It is the figure which looked down at the electronic apparatus 10 which opened the display case 18 with respect to the main body case 14 by the hinge 20, and is the use state from above. The following will be viewed from the front figure 1 ...

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Abstract

An electronic apparatus is provided. The electronic apparatus (10) includes a main body chassis (14) equipped with a keyboard device (12), a CPU (28), a heat diffusion component and a heat transport component. The CPU is disposed on a rear end side beyond the keyboard device (12).

Description

technical field [0001] The present invention relates to an electronic device including a CPU in a main body casing. Background technique [0002] Conventionally, in electronic equipment such as notebook computers (notebook personal computers), a structure in which a substrate (motherboard) on which a CPU (Central Processing Unit) is mounted is generally disposed below a keyboard device (for example, see Patent Document 1). In such electronic equipment, generally, the CPU is the largest heat generating body. Therefore, in the configuration of Patent Document 1, since the heat pipe is connected to the CPU, the generated heat can be efficiently radiated to the outside. [0003] Patent Document 1: Japanese Patent No. 5976712 [0004] However, a keyboard device generally has a structure in which a key head, a zoom-type guide mechanism, a diaphragm, a base plate, and the like are stacked, for example, and has a certain thickness. In addition, the substrate and the CPU mounted o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16G06F1/20
CPCG06F1/1616G06F1/1662G06F1/203H01L23/427G06F1/20G06F1/18G06F1/16G06F1/1635H05K5/03H05K7/20154H05K7/20336
Inventor 内野显范藤井一男上村拓郎渡村宪司山崎央星野鹰典
Owner LENOVO PC INT
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