Packaging structure, electronic device and packaging method
A technology of encapsulation structure and encapsulation method, which is applied in the direction of circuits, electrical components, electric solid devices, etc., and can solve the problems of reduced lifespan of electronic devices, poor ability to resist water vapor and oxygen, etc.
Active Publication Date: 2020-08-18
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0002] Some electronic devices, such as OLED devices, are less resistant to water vapor and oxygen, and the lifetime of these electronic devices will be reduced if exposed to water vapor or oxygen
Method used
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[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present invention.
[0032] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those skilled in the art to which the present invention belongs. "First", "second" and similar words used in the patent application specification and claims of the present invention do not indicate any order, quantity or impo...
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A packaging structure, an electronic device and a packaging method. The packaging structure includes: a first substrate, a second substrate, a first sealant and a second sealant. The second substrate is arranged opposite to the first substrate; the first sealant and the second sealant are arranged between the first substrate and the second substrate and bond the first substrate and the second substrate to each other; the first sealant includes The first slope of the substrate; the second sealant includes a second slope away from the second substrate, and the second slope is attached to the first slope; in a direction parallel to the first substrate and the second substrate, the first slope and the second The slope extends from the first position to the second position, along the direction from the first position to the second position, the distance from the first slope to the first substrate changes gradually, and the distance from the second slope to the The distance from the second substrate changes gradually; and, within the range from the first position to the second position, the distance from the first slope to the first substrate is substantially equal to the sum of the distances from the second slope to the second substrate. The encapsulation structure has better airtightness and longer service life.
Description
technical field [0001] At least one embodiment of the present disclosure relates to a packaging structure, an electronic device, and a packaging method. Background technique [0002] Some electronic devices, such as OLED devices, are less resistant to water vapor and oxygen, and their lifespan will be reduced if exposed to water vapor or oxygen. For the packaging of electronic devices, the current packaging technology includes packaging with sealant and packaging cover plate and thin film packaging technology. Achieving good packaging effect is of great significance to improve the service life of electronic devices. Contents of the invention [0003] At least one embodiment of the present disclosure provides a packaging structure, which includes: a first substrate, a second substrate, a first sealant, and a second sealant. The second substrate is arranged opposite to the first substrate; the first sealant and the second sealant are arranged between the first substrate and...
Claims
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IPC IPC(8): H01L51/52H01L33/54
CPCH01L33/54H01L2933/005H10K71/40H10K59/8722H10K50/8426H10K59/12H10K71/00
Inventor 李子华问智博郭强金文强袁羽王旭东
Owner BOE TECH GRP CO LTD