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Laser double-sided machining alignment technology

A double-sided processing and laser technology, which is applied to the formation of electrical connections of printed components, electrical components, printed circuit manufacturing, etc., can solve problems such as high temperature, difficult blind hole alignment, and affect the quality of blind hole processing, etc., to achieve convenience View and monitor the effects of improving process quality

Active Publication Date: 2019-02-05
BRAIN POWER (QING YUAN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing micro-blind holes are made by single-sided laser ablation, and it is difficult to align the upper and lower sides of the blind holes, and it is also difficult to effectively fix the PCB board before processing and alignment, which will cause deviations in the processing results and affect the blind holes. The processing quality of the hole, and the temperature of the blind hole is high after processing and alignment, which is not convenient for the staff to perform distance measurement processing on it

Method used

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  • Laser double-sided machining alignment technology

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Embodiment Construction

[0023] see figure 1 , in an embodiment of the present invention, a laser double-sided processing alignment process includes the following steps:

[0024] 1) Reclaiming: Manually place the PCB to be processed on the processing platform;

[0025] 2) Micro-processing: Wipe the edge of the PCB board clockwise with a dry paper towel, and blow off the dust on the edge of the PCB board with a blower, where the rated voltage of the blower is 220V, and the air volume is 2.2m 3 / min, the rated power of the blower is 600W, and the diameter of the air outlet of the blower is 3cm;

[0026] 3) Positioning: G-shaped clamps are used to clamp the edge of the PCB board, wherein the G-shaped clamps include a clamp body, a T-shaped screw rod, a threaded screw welded under the T-shaped screw rod, and a threaded wire The movable clamping head under the rod, wherein the clamping length of the G-shaped clamp is 25mm, and the size of the G-shaped clamp is 1 inch, the clamping depth of the G-shaped c...

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Abstract

The invention discloses a laser double-sided machining alignment technology. The technology includes the following steps: placing a to-be-machined PCB on a machining platform through a manual manner;performing clockwise wiping on the edge of the PCB through a dry paper towel; and blowing dust on the edge of the PCB through a blower, wherein the rated voltage of the blower is 220 V, and air outputis 2.2 m<3> / min. Through machining alignment, a laser head can be controlled to work by two sets of alignment probes, so that the blind hole aligning machining operation of the upper and lower surfaces of the PCB can be accomplished, and the machining quality of the blind holes can be enhanced; through the addition of a positioning process, fixing on the PCB before machining alignment can be performed, and the problem of poor blind hole machining quality of the PCB caused by position deviation during machining can be avoided; and through the addition of a cooling process, rapid cooling treatment can be performed on the blind holes with high temperatures, and users can conveniently and timely check and detect the machining quality of the blind holes.

Description

technical field [0001] The invention relates to the technical field of PCB board processing technology, in particular to a laser double-sided processing alignment technology. Background technique [0002] PCB, also known as printed circuit board, printed circuit board, or printed board for short, uses an insulating board as the base material, cuts to a certain size, has at least one conductive pattern attached to it, and is equipped with holes (such as component holes, fastening holes, Metallized holes, etc.), used to replace the chassis of the previous electronic components and realize the interconnection between electronic components. Since this board is made by electronic printing, it is called a "printed" circuit board. It is not accurate to call "printed circuit board" as "printed circuit" because there are no "printed components" on the printed board but only wiring, and under the premise that electronic products tend to be multifunctional and complex , the contact di...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0026H05K3/0044H05K3/423
Inventor 王道子张义坤彭亮
Owner BRAIN POWER (QING YUAN) CO LTD
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