Ceramic tile cutting process and device

A technology of cutting equipment and cutting process, applied in the field of ceramic tile processing, can solve the problems of large cutting allowance, easily damaged tile plates, and large loss of tile plates, and achieves the effect of small cutting allowance, wide adaptability and loss reduction.

Pending Publication Date: 2019-02-15
佛山市爱陶机电设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The tile cutting equipment in the prior art generally uses direct cutting to cut the tile slabs. Due to the aging of the equipment or the wear of the cutter wheel, the tile cutting equipment and the cutting process are easy to damage the tile slabs on the one hand, such as On the other hand, there is a defect that the cutting allowance is too large and the loss of the tile plate is relatively large.

Method used

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  • Ceramic tile cutting process and device
  • Ceramic tile cutting process and device
  • Ceramic tile cutting process and device

Examples

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no. 1 example

[0061] The technical solutions in the embodiments of the present invention will be described clearly and in detail below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. see figure 1 , is the first embodiment of the ceramic tile cutting process of the present invention, including:

[0062] S1: Cut the bottom surface of the tile to be cut;

[0063] After the tiles to be cut are transported manually or by a conveying mechanism, the bottom surface of the tiles to be cut can be cut first, that is, the bottom cutting operation, and a relatively deep cut mark is formed on the bottom of the tiles to be cut.

[0064] S2: Sc...

no. 2 example

[0068] The first embodiment of the ceramic tile cutting process of the present invention has been introduced above, and the second embodiment of the ceramic tile cutting process of the present invention will be described in detail below, please refer to figure 2 , the second embodiment of the ceramic tile cutting process of the present invention, comprising:

[0069] 201: Perform centering or guiding processing on the tiles to be cut, and make the tiles to be cut enter the cutting device according to the set position;

[0070] After the tiles to be cut are loaded, the tiles to be cut can be centered or guided first, so that the tiles to be cut can enter the cutting equipment according to the set position. It should be noted that the tiles to be cut can also be directly fed to the set cutting position by the robot without adding a centering process, which is not limited here.

[0071] 202: cutting the bottom surface of the tile to be cut;

[0072] Then the bottom surface of ...

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Abstract

The invention discloses a ceramic tile cutting process and device. By the adoption of a ceramic tile cutting method for cutting the bottom and scratching the face, one knife cuts the bottom face of ato-be-cut ceramic tile to a certain depth, another knife scratches marks on the top face of the to-be-cut ceramic tile, the back face of the to-be-cut ceramic tile is cut off along the cutting line through a breaking device, and the probability of breaking like edge breakage and bottom falling in the cutting process of the to-be-cut ceramic tile is effectively reduced. The ceramic tile cutting device comprises a ceramic tile cutting device body which comprises a conveying mechanism and a cutting mechanism; the cutting mechanism comprises a bottom cutting module and a face scratching module; the bottom cutting module is arranged below the conveying mechanism and used for cutting the bottom face of the to-be-cut ceramic tile; and the face scratching module is arranged above the conveying mechanism and used for scratching the top face of the to-be-cut ceramic tile.

Description

technical field [0001] The invention relates to the field of tile processing, in particular to a tile cutting process and tile cutting equipment. Background technique [0002] Tile cutting equipment is a kind of fully automatic or semi-automatic equipment specially used for cutting ceramic tiles. [0003] The tile cutting equipment in the prior art generally uses direct cutting to cut the tile slabs. Due to the aging of the equipment or the wear of the cutter wheel, the tile cutting equipment and the cutting process are easy to damage the tile slabs on the one hand, such as On the other hand, there is a defect that the cutting allowance is too large and the loss of the tile plate is relatively large. [0004] Therefore, in view of the above situation, how to improve the structure of the existing tile cutting equipment or the tile cutting process so as to solve the above problems has become an important technical problem to be solved urgently by those skilled in the art. C...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/04B28D1/22
CPCB28D1/04B28D1/225
Inventor 丁建盛刘钊辉敖杰
Owner 佛山市爱陶机电设备有限公司
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