Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Common-mode conduction EMI (Electromagnetic Interference) modeling method and device for MMC (Modular Multilevel Converter) three-phase grid-connected inversion system

A technology of inverter system and modeling method, applied in the direction of output power conversion device, circuit device, AC network circuit, etc., to achieve the effect of simplifying analysis, facilitating design, and improving prediction speed

Active Publication Date: 2019-02-15
HUAZHONG UNIV OF SCI & TECH
View PDF3 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In view of the above defects or improvement needs of the prior art, the present invention provides a common-mode conduction EMI modeling method and device for an MMC three-phase grid-connected inverter system, thereby solving the problem of accuracy and effectiveness of the existing EMI modeling method. Technical issues with certain limitations

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Common-mode conduction EMI (Electromagnetic Interference) modeling method and device for MMC (Modular Multilevel Converter) three-phase grid-connected inversion system
  • Common-mode conduction EMI (Electromagnetic Interference) modeling method and device for MMC (Modular Multilevel Converter) three-phase grid-connected inversion system
  • Common-mode conduction EMI (Electromagnetic Interference) modeling method and device for MMC (Modular Multilevel Converter) three-phase grid-connected inversion system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0038] The present invention proposes a common-mode conduction EMI modeling method and device for an MMC three-phase grid-connected inverter system, and rapidly and accurately predicts the system common-mode conduction EMI model through the common-mode conduction high-frequency EMI model of the three-phase MMC grid-connected inverter system Mode interference.

[0039] like figure 1 Shown is a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a common-mode conduction EMI (Electromagnetic Interference) modeling method and device for an MMC (Modular Multilevel Converter) three-phase grid-connected inversion system. Onthe basis of the propagation characteristics of common-mode conduction EMI, the high-frequency equivalent model of each key component in the MMC three-phase grid-connected inversion system is combined to establish the common-mode conduction high-frequency EMI model of the MMC three-phase grid-connected inversion system, a common-mode conduction EMI frequency domain prediction result obtained on the basis of a superposition principle is compared with an EMI frequency spectrum of which the time domain simulation waveform is subjected to FFT (Fast Fourier Transform) so as to discover that a frequency domain simulation result and a time domain simulation result can be favorably matched in 10kHz-10MHz, and the validity of the common-mode conduction high-frequency EMI model, which is put forward, of the MMC three-phase grid-connected inversion system can be verified. By use of a frequency domain prediction method, the common-mode frequency domain prediction of an MMC converter is realized,the EMI prediction time of the MMC converter can be greatly shortened, and the design of the EMI filter of the MMC device is effectively guided.

Description

technical field [0001] The invention belongs to the technical field of EMI prediction of power electronic devices, and more specifically relates to a common-mode conduction EMI modeling method and device for an MMC three-phase grid-connected inverter system. Background technique [0002] In recent years, the flexible direct current transmission technology using fully-controlled power electronic devices such as insulated gate bipolar transistors (Insulated Gate Bipolar Transistor, IGBT) has the advantages of fast dynamic response, good controllability and flexible operation mode. widely used in power transmission systems. Due to the limitation of withstand voltage of power electronic devices, multi-level conversion must be used to be suitable for high-voltage and large-capacity flexible DC transmission systems. A modular multilevel converter (MMC) is used to divide the high voltage into multiple levels and distribute them to each device and module, so that the voltage stress...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H02J3/36H02M7/483H02M1/44
CPCH02J3/36H02J2203/20H02M1/44H02M7/483Y02E60/60
Inventor 裴雪军王美娟向洋霄孙涛蒋栋李桥
Owner HUAZHONG UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com