LED display unit group and display panel

Abstract

The invention discloses an LED display unit group. The LED display unit group comprises a circuit board, and n lines and m columns of pixel units in array arrangement and located on the circuit board;the circuit board comprises N layers of metal circuit layers stacked in sequence, and insulating plates located between the adjacent metal circuit layers; the N layers of metal circuit layers are electrically connected through metal via holes in the insulating plates, wherein N is larger than or equal to 3; and each pixel unit comprises at least two LED light-emitting chips with different light-emitting colors, and the LED light-emitting chips are fixed on the first metal circuit layer, wherein n and m are both positive integers greater than or equal to 3. By virtue of the LED display unit group provided by the invention, the size of the display unit group is further reduced under a condition of not reducing the dimensions of the bonding pads and the metal circuits, and a high-resolutionLED display screen with the pixel spacing of 0.8mm or less can be realized.

Description

technical field [0001] The embodiments of the present invention relate to the technical field of LED display, and in particular to an LED display unit group and a display panel. Background technique [0002] With the continuous improvement of indoor display application technology, indoor small-pitch LED display screens will become the main technology development space in the future. In order to replace LCD and DLP indoor high-definition display products, the pixel unit density requirements of indoor small-pitch LED display screens are getting higher and higher, namely The pixel unit pitch is required to be smaller and smaller. [0003] Existing small-pitch display screens mainly use 2121, 1515, 1010, 0808 and other independent packaged devices, each packaged device includes 4 pins, and the pins of multiple independently packaged devices are welded on the PCB to form a display panel. With the rapid development of LED display screens towards small pitches, the size of the co...

AI Technical Summary

Problems solved by technology

However, the pads and metal traces in the packaging module occupy most of the area. When the size of the pads and metal traces remains unchanged, it is difficult to further reduce the size of the packaging module; if the pads and metal traces are reduced size, it will lead to increased wire resistance and poor circuit stability

Therefore, it is difficult to continue reducing the size of the package module, and it is difficult to realize an LED display screen with a pixel unit pitch of less than 0.8 mm using the package module of the prior art.

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