Laminating device for false and orthobaric pressure integration of flexible circuit board

Abstract

The invention relates to a laminating device for false and orthobaric pressure integration of flexible circuit board. The laminating device comprises a first lateral transfer device, a false pressuremodule, an orthobaric pressure module, a false pressure supporting mechanism and an orthobaric pressure supporting mechanism an a substrate transfer device. The false pressure module is configured toperform a false pressure operation on a substrate located at a false pressure working position, so that at least one flexible circuit board is falsely joined to at least one circuit assembly area on one side edge of the substrate. The orthobaric pressure module is configured to perform an orthobaric pressure operation on the substrate on which the false pressure operation has been performed, so that the flexible circuit board that has been falsely joined to the substrate is permanently joined to the circuit assembly area of the substrate. Both of the false pressure module and the orthobaric pressure module can perform lateral movement on the first lateral transfer device, when the false pressure module performs the false pressure operation, the orthobaric pressure module is located on oneside of the first lateral transfer device to evade an operation space for the false pressure module, and when the orthobaric pressure module performs the orthobaric pressure operation, the false pressure module is located on the other side of the first lateral transfer device to evade an operation space for the orthobaric pressure module.

Description

technical field [0001] The present invention relates to circuit board assembly equipment, in particular to a laminating device for assembling a flexible circuit board to a rigid circuit board or a flexible circuit board of a display panel. Background technique [0002] A flexible circuit board is assembled into the circuit assembly area around a display panel through a dummy pressing operation and a single pressing operation, so that the flexible circuit board and the display panel form an electrical connection, which has become a common flexible circuit board. Assembling technology, those related thereto, such as China Taiwan Announcement No. I381200, China Taiwan Announcement No. I443057, China Taiwan Announcement No. I523594, Chinese Taiwan Announcement No. I523593, Chinese Taiwan Announcement No. M412376, Chinese Taiwan Announcement No. M406035 , China Taiwan Announcement No. I328990 and China Taiwan Announcement No. M298306 and other patents, as well as China Taiwan Pub...

AI Technical Summary

Problems solved by technology

However, in order to minimize the border of the framed display, the circuit assembly area reserved for the above-mentioned flexible circuit board in the current display panel has become narrower and narrower. For example, the circuit assembly area has been reduced from about 1 to 2mm in width, narrowed to less than or equal to 0.4mm

When the circuit assembly area of ​​a display panel is narrowed to this extent, the flexible circuit board that is falsely assembled in the circuit assembly area by the false pressure device is no longer firmly attached (because the joint surface of the two too small), so that in the process of transporting the display panel to the local pressure equipment, the flexible circuit board often falls, which needs to be solved urgently

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