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Multi-layer PCB stacking method

A PCB board and board body technology, which is applied in the field of stacking multilayer PCB boards, can solve the problems of difficulty in distinguishing and reducing the production efficiency of multilayer PCB boards, and achieve the effects of convenient distinction, prevention of production efficiency reduction, and convenient tracking

Active Publication Date: 2019-03-08
AOSHIKANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the existing stacking process of multi-layer PCB boards, the way of covering is usually used for stacking and fixing, which makes it difficult to distinguish between the various layers of the multi-layer PCB board during the processing process, reducing the production efficiency of the multi-layer PCB board

Method used

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Embodiment Construction

[0039] In order to facilitate a better understanding of the present invention, the present invention will be further explained below in conjunction with the accompanying drawings of related embodiments. Embodiments of the invention are shown in the drawings, but the invention is not limited to the preferred embodiments described above. Rather, these embodiments are provided so that the disclosure of the invention will be more thorough.

[0040] In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures...

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Abstract

The invention provides a multi-layer PCB stacking method. The multi-layer PCB stacking method comprises the steps of: receiving a stacking instruction, and performing PCB stacking according to the stacking instruction; obtaining a bonding pad identifier, and performing bonding pad choking on a corresponding PCB according to the bonding pad identifier, so that a bonding pad PCB is obtained; obtaining a copper sheet identifier, and performing copper sheet choking on a corresponding PCB according to the copper sheet identifier, so that a copper sheet PCB is obtained; respectively performing choking detection on the bonding pad PCB and the copper sheet PCB, and, when the fact that the choking detection of the bonding pad PCB or the copper sheet PCB is unqualified is judged, performing prompt marking on the corresponding PCB; placing a heat transfer plate between adjacent PCBs, and pressing the stacked PCBs; and, obtaining coding information, and performing coding marking on the PCBs according to the coding information. According to the multi-layer PCB stacking method provided by the invention, the PCBs are subjected to bonding pad choking or copper sheet choking; therefore, various laminates are conveniently distinguished; the processing error due to wrong distinguishing is prevented; the quality of multiple PCBs is improved; and low production efficiency due to difficult distinguishing is prevented.

Description

technical field [0001] The invention relates to the technical field of PCB boards, in particular to a multilayer PCB board stacking method. Background technique [0002] In recent years, with the recovery of the semiconductor industry, the circuit board market has continued to develop, which is mainly due to two driving forces. First, the market space for the circuit board application industry continues to expand, and the application of the communication industry and the notebook computer industry has improved, making the high-end multilayer circuit board market grow very rapidly. At the same time, the proportion of digital circuit boards used in color TVs, mobile phones, and automotive electronics has also increased significantly, which has continuously expanded the space for the circuit board industry. Due to the fierce competition in the PCB industry, some major PCB manufacturers actively develop new technologies, increase the number of PCB layers or promote the marketiz...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4611H05K2203/068
Inventor 贺周张亮杨灿辉罗新权
Owner AOSHIKANG TECH CO LTD
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