Low-viscosity filler composition and preparation method thereof

Abstract

The invention relates to a low-viscosity filler composition and a preparation method thereof. The method comprises the following steps of: adding spherical silicon dioxide micro powder with grain sizes D50 ranging from 3mu m to 60mu m into one of or a mixture of several of resin, a curing agent or a solvent, stirring at a high speed, and then preparing an ingredient A; then adding spherical silicon dioxide micro powder with grain sizes D50 ranging from 0.01mu m to 3mu m into the resin or the curing agent, stirring slowly by using dispersion equipment, and adding a diluent to disperse to prepare an ingredient B; taking the ingredient A as a matrix, adding the ingredient B, adding the diluent simultaneously, dispersing and homogenizing by using mixing and stirring equipment to prepare the low-viscosity filler composition. According to the method, a filler coarse powder part with a good processing property is prepared firstly; then a filler fine powder part with a good dispersion effect is dispersively prepared, and the composition obtained by using the two parts has the characteristics of excellent dispersity and low viscosity.

Description

technical field [0001] The invention relates to the technical field of deep processing of inorganic non-metallic materials, in particular to a low-viscosity filler composition and a preparation method thereof. Background technique [0002] As an electronic material, filler is widely used in epoxy molding compound industry, copper clad laminate, coating and adhesive and other industries. It plays a key role in improving the high hardness, corrosion resistance, scratch resistance, insulation and low warpage of downstream products. However, if a certain amount of filler is added, the viscosity of the resin system will increase accordingly. If the filling amount exceeds 50%, the surface of the product will be rough, white spots, insufficient smoothness and the viscosity will rise rapidly due to the inability to disperse the fine powder of the filler. In order to fully maintain the excellent performance of the filler, it is necessary to find a material with low system viscosity ...

AI Technical Summary

Problems solved by technology

[0003] Chinese patent CN 104558688 B discloses a D50 of 5-11 μm angular silica, D50 of 1-15 μm spherical silica powder (85-99%) and D50 of 10-100nm nano-silica (1-15 %) to form a filler composition prepared by mixing fillers, which reduces the viscosity to a certain extent, but nano-silica is difficult to disperse when the filling amount is high (above 50%), and it is impossible to further improve product quality and viscosity performance Require

However, this method has two disadvantages.

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