A mechanical dynamic model analysis method for flexible MEMS electrostatically actuate switches
An electrostatic drive, dynamic model technology, applied in the field of mechanical analysis, can solve problems such as blank
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Embodiment 1
[0044] The MEMS is a double-terminal fixed beam type RF MEMS. The material of the RF MEMS double-terminal fixed beam electrostatically driven switch beam is gold, and the flexible substrate material is liquid crystal polymer (LCP). The length of the beam is L=600μm, and the width of the beam is w = 100 μm, the thickness of the beam t = 2 μm, the initial distance between the upper and lower plates g = 2 μm, the Young’s modulus E of the beam = 78 Gpa, Poisson’s ratio n = 0.42. The above-mentioned RF MEMS double-terminal fixed beam electrostatic drive switch initially has biaxial residual compressive stress, the beam buckles upward, and the maximum buckling distance h=0.5μm, as the flexible substrate gradually bends, the curvature of the substrate gradually increases from 0 to 33.3m -1 , Apply a bias voltage of 1.4 times the threshold voltage between the upper and lower plates of the switch.
[0045] combine figure 1 This embodiment is described, specifically including the follo...
Embodiment 2
[0097]MEMS is a double-ended cantilever beam type RF MEMS. The material of the RF MEMS cantilever beam electrostatically driven switch beam is gold, and the flexible substrate material is liquid crystal polymer (LCP). The length of the beam is L=150μm, the width of the beam is w=100μm, and the The thickness t=2μm, the size of the lower plate is length L'=60μm; width w'=150μm, the thickness is determined by the thickness of the CPW transmission line. If the cantilever beam structure electrostatic actuator initially has a biaxial residual compressive stress of 2.5MPa, as the flexible substrate is gradually bent, the curvature of the substrate will gradually increase from 0 to 33.3m -1 , Apply a bias voltage of 1.4 times the threshold voltage between the upper and lower plates of the switch.
[0098] to combine figure 1 This embodiment is described, specifically including the following steps:
[0099] Step 1, establish the mechanical dynamic model of the RF MEMS electrostatic d...
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