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Grinding wheel and grinding apparatus

A grinding and grinding wheel technology, which is applied to grinding drive devices, grinding workpiece supports, grinding machine parts, etc., can solve the problems of insufficient occlusal performance, unable to fully ensure the occlusal performance of the ground surface, etc., and achieve improvement. The effect of occlusal performance

Active Publication Date: 2019-03-19
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it may happen that the bite performance to the ground surface cannot be sufficiently ensured
In particular, such a problem of insufficient interlocking performance tends to occur in wafers made of relatively hard materials such as SiC and sapphire.

Method used

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  • Grinding wheel and grinding apparatus
  • Grinding wheel and grinding apparatus
  • Grinding wheel and grinding apparatus

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Experimental program
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Effect test

Embodiment Construction

[0019] Hereinafter, a grinding device according to the present embodiment will be described with reference to the drawings. figure 1 It is a perspective view of the grinding apparatus of this embodiment. Additionally, the grinding device is not limited to figure 1 The apparatus structure dedicated to grinding processing as shown can be incorporated into a fully automatic processing apparatus that performs a series of processing such as grinding processing, polishing processing, and cleaning processing in a fully automatic manner, for example.

[0020] Such as figure 1 As shown, the grinding apparatus 1 is configured to grind a wafer W held by a chuck table (holding table) 20 using a grinding wheel 46 in which a plurality of segmented grindstones 47 are arranged in an annular shape. The wafer W is loaded into the grinding apparatus 1 with the protective tape T attached thereto, and is held on the holding surface 21 of the chuck table 20 . In addition, as long as the wafer W ...

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Abstract

A grinding wheel and a grinding apparatus are provided to improve an ability to bite into the surface being ground. The grinding wheel (46) includes, in order to grind a wafer W, a plurality of grinding stone groups arranged in an annular array and each formed by a plurality of grinding stone segments (47), each of the grinding stone groups including at least three grinding stone segments (471-473) having different thicknesses. The grinding stone segments having different thicknesses are successively arranged in the order from the grinding stone segment (471) having the smallest thickness to the grinding stone segment (473) having the largest thickness and have respective radially inner edges aligned with each other in an annular shape, with uniform gaps left therebetween.

Description

technical field [0001] The invention relates to a grinding wheel and a grinding device. Background technique [0002] A grinding apparatus for grinding a wafer rotates a grinding wheel in which a plurality of segmented grindstones are arranged in a ring shape, and grinds a grinding surface of a wafer with the segmented grindstones. Conventionally, a grinding wheel having a grinding wheel that grinds the center portion of a wafer to be ground uniformly and with high precision without generating one-sided undercut has been proposed (for example, refer to Patent Document 1). [0003] In the grinding wheel described in Patent Document 1, among the plurality of grinding tools annularly attached to the end face of the grinding wheel, the approaching part arranged close to the center side of the grinding wheel and the part far away from the grinding wheel are alternately provided. The remote parts arranged at the center of the center are point-symmetrically arranged with the cente...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B7/22B24B47/20B24B41/06B24B27/00
CPCB24B7/228B24B27/0015B24B41/068B24B47/20B24D7/066B24B7/04B24D7/06
Inventor D·佩迪加
Owner DISCO CORP
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