Unlock instant, AI-driven research and patent intelligence for your innovation.

Chip testing device, system and method

A chip testing and chip technology, applied in the electronic field, can solve problems affecting the cost of chips

Inactive Publication Date: 2019-03-19
COMBA TELECOM SYST CHINA LTD
View PDF6 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Chip verification and testing are very important links in the mass production of chips. Each chip must be functionally tested before shipment to ensure the yield of the shipped chips, and this testing process also directly affects the cost of the chip.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip testing device, system and method
  • Chip testing device, system and method
  • Chip testing device, system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0033] An embodiment of the present invention provides a chip testing device, figure 1 A schematic diagram of its structure is shown. Such as figure 1 As shown, at least a test base 1 is included; the test base includes a test control unit 11 , a test interface unit 12 , a power access unit 13 and a chip access unit 14 . The test control unit 11 includes at least a programmable logic unit 111, which is used to provide a logic circuit sui...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention relates to the technical field of electronics, particularly relates to a chip testing device, system and method, and aims at providing a universal testing device whichcan adapt to various types of chips. The device comprises a testing bottom plate; the testing bottom plate comprises a testing control unit, a testing interface unit, a power accessing unit and a chipaccessing unit; the testing control unit at least comprises a programmable logic unit, and the programmable logic unit is used for providing a logic circuit which is suitable for a to-be-tested chip;the chip assessing unit is used for providing a chip interface which matches with the to-be-tested chip to allow the to-be-tested chip to be electrically connected with the programmable logic unit; the testing interface unit is electrically connected with the testing control unit and used for receiving a testing instruction transmitted by operation equipment and provides the testing instruction to the programmable logic unit; the power supply accessing unit is used for connecting a power supply and providing electricity for the testing bottom plate.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a chip testing device, system and method. Background technique [0002] Chip verification and testing are very important links in the mass production of chips. Each chip must be functionally tested before shipment to ensure the yield of the shipped chips, and this testing process also directly affects the cost of the chip. . [0003] For physical IT companies, due to the large output of equipment, the number and types of chips that need to be imported will be large. For these chips imported from external factories, the company needs to conduct a preliminary inspection of these chips to determine whether the internal firmware version of the chip is correct and whether the basic functions are normal. Since the chip packaging of different manufacturers varies greatly, and not every chip manufacturer can provide a complete set of fixtures from the base to the test platform. Th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/04
CPCG01R1/0416G01R31/2886G01R31/2889
Inventor 陈炳锐方彬浩肖夕
Owner COMBA TELECOM SYST CHINA LTD