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Chip bonding apparatus and method of manufacturing semiconductor device

A chip placement and placement technology, applied in the field of chip placement devices, can solve problems such as not grasping the movement track of the placement head, generation of defective products, and device failures

Active Publication Date: 2019-03-19
FASFORD TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, the chip mounter operates the pick-up head and the placement head at high speed in order to improve productivity. Therefore, the risk of device failure and defective products due to increased mechanical load and vibration increases.
[0009] However, there is currently a problem that there is no mechanism to detect abnormalities in advance by accurately grasping the movement trajectory and vibration of the placement head, etc. during the operation of the device

Method used

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  • Chip bonding apparatus and method of manufacturing semiconductor device
  • Chip bonding apparatus and method of manufacturing semiconductor device
  • Chip bonding apparatus and method of manufacturing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Deformed example 1

[0108] Figure 17 yes means Figure 10 The graph of the acceleration waveform, velocity and position in the state of Figure 17 (A) is a diagram showing the acceleration waveform in the Y direction, Figure 17 The (B) is for the Figure 17 A diagram of the velocity waveform in the Y direction obtained by integrating the waveform of (A), Figure 17 The (C) is for the Figure 17 The graph of the Y-direction position waveform obtained by integrating the waveform of (B).

[0109] In the embodiment, when the placement head 41 is driven in the Y direction in (a2) above, the vibration displacement in the Y direction is obtained from the difference between the acceleration signal waveform obtained from the gyro sensor 45 and the command acceleration waveform. In Example 1, it is obtained from the difference between the movement trajectory of the placement head 41 and the command position waveform.

[0110] (b1) The operation abnormality diagnosis unit 214 obtains the vibration d...

Deformed example 2

[0116] Figure 18 It is a figure which shows the installation position of the gyro sensor of the modification 2.

[0117] In the embodiment, the case where the gyro sensor 45 is provided near the center O of the mounting head 41 close to the intersection of the driving axes of the X direction, the Y direction, and the Z direction for driving the mounting head 41 has been described. It is not limited to this, and it can be installed in the place where the sensor can be attached between the front-end|tip of the collet 42 of the mounting head 41 and the upper end of the mounting head 41.

[0118] Such as Figure 18 As shown, when the gyro sensor 45 is provided at or near the tip of the collet 42 of the placement head 41, it is possible to directly grasp the vibration that affects the placement accuracy.

[0119] In Modification 2, the 6-axis gyro sensor is provided at or near the collet tip of the placement head. In this way, the vibration that affects the placement accuracy (...

Deformed example 3

[0128] Figure 19 It is a figure which shows the abnormality determination method of the modification 3. exist Figure 19 In FIG. 3 , the composite waveform of the vibration displacement in the X direction and the vibration displacement in the Y direction when the mounting head 41 is driven in the Y direction is shown for ease of illustration.

[0129] In Examples and Modifications 1 and 2, the abnormality diagnosis is performed with a single threshold value for the maximum displacement of the synthesized waveform, but the following method may also be used: the locus of the vibration displacement in the XYZ direction and the X-axis relative to the standard measured multiple times When the trajectory of the vibration displacement in the Y-axis and Z-axis rotational directions is separated by a certain distance, it is determined to be abnormal. In this method, it is not necessary to obtain the maximum displacement from the synthesized waveform. When this is applied to an Exam...

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PUM

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Abstract

The present invention provides a chip bonding apparatus provided with a mechanism detecting abnormity of bonding heads and the like. The apparatus includes a bare chip supplying part; a substrate supplying part; a bonding part used for bonding a bare chip supplied by the bare chip supplying part to a substrate supplied by the substrate supplying part or a bare chip already bonded to the substrate;and a control part controlling the bare chip supplying part, the substrate supplying part and the bonding part. The bonding part includes a bonding head including a collet chuck for adsorbing the bare chip; a driving portion including a driving shaft for moving the bonding head; and a sensor capable of detecting the angular velocity and acceleration of the bonding head. The control unit comparesa vibration displacement with a threshold value of the vibration displacement set in advance using the result obtained by the sensor, thereby determining the abnormality.

Description

technical field [0001] The present invention relates to a die bonding device, and is applicable to a die bonding device including, for example, a gyro sensor. Background technique [0002] In a part of the manufacturing process of a semiconductor device, there is a process of mounting a semiconductor chip (hereinafter, simply referred to as a die) on a wiring board, a lead frame, etc. (hereinafter, simply referred to as a substrate) and assembling a package. , In the process of assembling the package, there are the following steps: a step of dividing a bare chip from a semiconductor wafer (hereinafter, simply referred to as a wafer); and a mounting step of mounting the divided bare chip on a substrate. The manufacturing equipment used in the mounting process is a die bonding device such as a die bonder. [0003] A die mounter is a device that mounts (mounts and bonds) a bare chip on a substrate or a mounted bare chip using solder, plating material, or resin as a bonding mat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/02H01L21/67011H01L21/67126H01L21/67155H01L21/67242H01L21/67253H01L21/67144H01L21/67092H01L21/67712H01L21/67259H01L21/52
Inventor 楯充明
Owner FASFORD TECH