Heat dissipation and protection shell of integrated circuit for mobile phone circuit board

Abstract

The invention discloses a heat dissipation and protection shell of an integrated circuit for the mobile phone circuit board, comprising a first casing body and a second casing body. The first casing body comprises a casing and a first fan which is symmetrically distributed inside the casing. The casing is provided with a heat dissipation hole corresponding to position of the first fan. The centralinner surface of the casing is connected with a first duct, a second duct and a third duct through a first buckle, a second buckle and a third buckle separately. The first duct, the second duct and the third duct are filled with a heat dissipation auxiliary liquid inside. The second casing body comprises a base and two sets of second fans which are symmetrically mounted inside the base. The central position of the base is movably connected with a folding bracket through a pin, and a square slot is formed in the center of the upper surface of the base. According to the heat dissipation and protection shell of the integrated circuit for the mobile phone circuit board, two sets of heat dissipation shells are set, and the heat dissipation effect is remarkable, the bracket is added, and the heat dissipation is enhanced and it is also more convenient and comfortable for use.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation for mobile phones, and in particular relates to an integrated circuit heat dissipation protective shell for a mobile phone circuit board. Background technique [0002] As the saying goes: "A layman looks at the configuration, and an expert looks at the heat dissipation." Heat dissipation is one of the most important issues to be considered in the design process of an electronic product. Computers and mobile phones with excellent performance all have their own unique features in heat dissipation. Only in this way can we give full play to the strength of the various hardware of the product. Usually we often talk about the heat dissipation on the computer. It seems that the heat dissipation of the mobile phone is not so important, but in fact the requirements and technologies for the heat dissipation of the mobile phone are more complicated. Failures account for 65%-80% of the total failure...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an integrated circuit heat dissipation protection shell for mobile phone circuit boards, so as to solve the problems in the above-mentioned background technology that the heat dissipation effect is limited, and it needs to be hand-held to watch movies, and the comfort is not good.

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