Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A dynamic load balancing feeding control method for a semiconductor production line

A load balancing and dynamic load technology, applied in the field of automatic control and advanced manufacturing, can solve the problems of only focusing on the control of the workload of the bottleneck equipment, the research results cannot be directly applied, and the SA cannot adapt to the bottleneck drift, etc., to shorten the production cycle, real-time Good performance and the effect of reducing the number of products in process

Active Publication Date: 2021-03-26
TONGJI UNIV
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the above methods also have their own problems. For example, CONWIP will cause in-process product accumulation, and CONLOAD and SA cannot adapt to the "bottleneck drift" situation. Although the WR theory proposes a method to control the load of the entire production line, in practical applications, it is often only Focus on controlling bottleneck device workloads
Moreover, the above method ignores a large amount of related data that implies the characteristics of the actual scheduling environment of the production line and scheduling knowledge, which leads to the fact that the research results cannot be directly applied to the actual production line.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A dynamic load balancing feeding control method for a semiconductor production line
  • A dynamic load balancing feeding control method for a semiconductor production line
  • A dynamic load balancing feeding control method for a semiconductor production line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is carried out on the premise of the technical solution of the present invention, and detailed implementation and specific operation process are given, but the protection scope of the present invention is not limited to the following embodiments.

[0054] Such as figure 1 As shown, the present invention provides a kind of dynamic load balance feeding control method of semiconductor production line, the method utilizes the load balance feeding control parameter model based on ELM (Extreme Learning Machine, Extreme Learning Machine) to dynamically obtain the total load of semiconductor production line, with the total load of the semiconductor production line Guided by the load, the load control (WorkloadControl, WLC) theory is used to realize the load-balanced feeding control of the semiconductor production line, which specificall...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a semiconductor production line dynamic load balanced feeding control method. The semiconductor production line dynamic load balanced feeding control method comprises dynamically acquiring semiconductor production line total load through an ELM-based (extreme learning machine-based) load balanced feeding control parameter model, and under the guidance of the semiconductorproduction line total load, achieving semiconductor production line dynamic load balanced feeding control through load control theories. The semiconductor production line dynamic load balanced feedingcontrol comprises the following steps of 1) structuring the load balanced feeding control parameter model, and inputting the real-time state and feeding information of a production line into the loadbalanced feeding control parameter model to dynamically acquire the semiconductor production line total load TWL_total; 2) structuring a semiconductor production line load balanced model, and according to the semiconductor production line total load TWL_total, acquiring feeding strategy information, including workpiece priority, feeding triggering mechanisms and feeding volume. Compared with theprior art, the semiconductor production line dynamic load balanced feeding control method has the advantages of being high in feeding control practicality and capable of reducing the number of products in process, shortening the production cycle, improving the production efficiency and the like.

Description

technical field [0001] The invention relates to a method in the field of automatic control, in particular to a dynamic load balancing feeding control method for a semiconductor production line, which belongs to the field of advanced manufacturing technology. Background technique [0002] The control and scheduling of semiconductor production lines has always been a hot topic in the academic and engineering circles. The research on optimal scheduling and control of semiconductor production line has important economic value and academic value. A good scheduling control strategy can help companies quickly respond to market demand, improve the ability of products to meet customer needs, ease capital accumulation, buffer storage space, reduce the time wafers are exposed to air, and improve production yield. [0003] There are two main types of scheduling on semiconductor production lines: feeding control and workpiece scheduling. The feeding control is at the front end of the d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/418
CPCG05B19/41865G05B2219/32252Y02P90/02
Inventor 乔非马玉敏高海
Owner TONGJI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products