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Electronic module
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A technology for electronic modules and electronic components, which is applied in the direction of circuits, electrical components, and electrical solid devices, and can solve the problem of increasing the size of the module.
Active Publication Date: 2019-03-22
SHINDENGEN ELECTRIC MFG CO LTD
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Abstract
Description
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Problems solved by technology
When terminals are provided on any one of the substrates on which the first electronic component or the second electronic component is installed, it is necessary to leave a space required for arranging the terminals, because the size of the module in the surface direction will become larger
Method used
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no. 1 approach
[0049] "constitute"
[0050] In this embodiment, "one side" refers to figure 1 The upper side of the , "the other side" refers to the figure 1 the lower side of the middle. Additionally, the figure 1 The up and down direction in the paper is called the "first direction", the left and right directions are called the "second direction", and the front and back directions on the paper are called the "third direction". The in-plane direction including the second direction and the third direction is called "plane direction", and viewing from one side is called "viewed from a plane".
[0052] Such as figure 1 As shown, the first electronic unit has: a first substrate 11 , a plurality of first conductor layers 12 disposed on one side of the first substrate 11 , and a first electronic component 13 disposed on one side of the first conductor layer 12 . Wherein, the f...
no. 2 approach
[0087] Next, a second embodiment among the present embodiments will be described.
[0088] In the first embodiment, although the first plane direction extending portion 114 and the second plane direction extending portion 124 are completely and substantially overlapped in plan view, in this embodiment, as Figure 6 As shown, in a planar view (the third direction), a part of the first plane direction extending portion 114 and a part of the second plane direction extending portion 124 are overlapped. About other structures, it is applicable to all the forms demonstrated in 1st Embodiment similarly to 1st Embodiment. The components described in the first embodiment are described using the same symbols.
[0089] Of course, the first electronic component 13 disposed on the first substrate 11 and the second electronic component 23 disposed on the second substrate 21 can realize different functions. At this time, if Figure 6 As shown in (b), the configurations of the first termin...
no. 3 approach
[0094] Next, a third embodiment among the present embodiments will be described.
[0095] In the above-mentioned embodiments, the first terminal portion 110 and the second terminal portion 120 are exposed to the outside of the packaging portion 90 on one side of the electronic module, which is a so-called SIP (Single Inline Package) structure. And in this embodiment, if Figure 7 As shown, the first terminal portion 110 and the second terminal portion 120 are exposed to the outside of the packaging portion 90 on two sides facing the electronic module, which is a so-called DIP (Dual Inline Package) structure. In this embodiment, all the aspects described in the above-mentioned embodiments can be employed. Components that have been described in the above-mentioned embodiments are denoted by the same reference numerals.
[0096] According to the present embodiment, since the terminal portion 100 is exposed to the outside of the package portion 90 by using two side surfaces, it ...
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Abstract
An electronic module is provided with a first substrate 11, a first electronic element 13, a second electronic element 23, a second substrate 21, a first terminal part 110 provided on the first substrate 11 side, and a second terminal part 120 provided on the second substrate 21 side. The first terminal part 110 has a first planar direction extension part 114 and a first normal direction extensionpart 113 extending to one side or the other side. The second terminal part 120 has a second planar direction extension part 124 and a second normal direction extension part 123 extending to one sideor the other side. The second planar direction extension part 124 is provided on one side of the first planar direction extension part 114, and the first planar direction extension part 114 and the second planar direction extension part 124 overlap in the planar direction.
Description
technical field [0001] The present invention relates to an electronic module having a terminal portion. Background technique [0002] Conventionally, an electronic module in which a plurality of electronic components is arranged in an encapsulating resin has been widely known (for example, refer to Japanese Patent Laid-Open No. 2014-45157). There is a general industry demand to be able to miniaturize such electronic modules. [0003] As one means of miniaturization, stacking electronic components can be considered. In this case, another electronic component (second electronic component) may be provided on one side (for example, the surface side) of the electronic component (first electronic component). [0004] Since the number of electronic components increases when this form is adopted, it is necessary to increase the number of terminals for connecting to external devices. When a terminal is provided on any one of the substrates on which the first electronic component o...
Claims
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Application Information
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