Semiconductor device
A technology of semiconductor and conductive sheet, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., and can solve problems such as breakdown
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no. 1 Embodiment approach
[0018] There are various examples of semiconductor devices using flip chip mounting. Here, an SSD will be described as an example. figure 1 It is a block circuit diagram showing an example of the configuration of the SSD of the embodiment. Such as figure 1 As shown, the SSD 10 includes a controller 20, flash memories 32-1, 32-2 (sometimes referred to as 32) as non-volatile semiconductor memories, DRAM (Dynamic Random Access Memory, dynamic random access memory) 54, power supply Circuit 58, host interface (host I / F) 52, etc.
[0019] An external device 50 as a host device is connected to the host I / F 52. The external device 50 performs writing and reading of data in the flash memory 32. The external device 50 includes, for example, a personal computer or a CPU (Central Processing Unit) core. As the interface with the external device 50, for example, PCI Express (registered trademark), SAS (Serial Attached SCSI) (registered trademark), SATA (Serial Advanced Technology Attachment)...
no. 2 Embodiment approach
[0056] Figure 5 It is a plan view showing an example of the external appearance of the SSD 10A of the second embodiment, Image 6 It is a cross-sectional view showing an example of a cross-sectional structure near the controller of the second embodiment.
[0057] The SSD 10A of the second embodiment differs from the SSD 10 of the first embodiment only in that the nameplate label 62 is attached. Usually, a nameplate label describing the model name or serial number is attached to the SSD. In the second embodiment, the nameplate label 62 is made of a conductive material, such as Figure 5 As shown, it is attached so as to cover the DRAM chip 54, the semiconductor package 16, and the memory chips 32-1, 32-2. So like Image 6 As shown, the nameplate label 62 covers the insulating layer 22 of the semiconductor package 16 constituting the controller, and covers the exposed portion 39 exposed from the insulating layer 22. Therefore, the nameplate label 62 and the exposed portion 39 are...
no. 3 Embodiment approach
[0061] Figure 7 An example of the ground connection of the SSD of the third embodiment is shown. According to the first and second embodiments, the charge flowing in the insulating layer 22 flows into the ground layer 42 of the SSD 10 via the exposed portions 39a, 39b, 39c, 39d, and the second through holes 38a, 38b, 38c, and 38d. The ground layer 42 of the SSD 10 is also connected to the ground terminal of the mounted chip other than the controller 20. Therefore, if the controller 20 causes the electric charge generated by static electricity to flow into the ground layer 42, the ground of other mounted chips connected to the ground layer 42 also becomes a high potential instantaneously, which may cause breakdown of other mounted chips. Similarly, the ground layer 42 instantaneously becomes a high potential due to potential fluctuations of other mounted chips, and the second through holes 38a, 38b, 38c, and 38d of the controller 20 become high potentials, and the controller 2...
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