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Micron-level metal wire high-precision automatic micro-assembly device based on micro-pre-tightening force monitoring

A technology of micro-pretension and metal wire, applied in the direction of mechanical equipment, material gluing, connecting components, etc., can solve the problems of difficult and efficient winding and fixing of wires evenly, difficulty in ensuring assembly accuracy and consistency, and backward assembly technology. Achieve the effect of automatic high-standard consistent micro-assembly, excellent assembly accuracy, and optimized and compact structure

Pending Publication Date: 2019-03-29
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the prior art, when the assembly of highly flexible fine metal wires is completed, most of them are realized by manual assembly. This assembly technology is relatively backward, and it is difficult to guarantee the assembly accuracy and consistency, and it is difficult to efficiently complete the uniform winding and winding of the wire. Fixed, and easy to cause filament breakage due to uneven application of external force, assembly efficiency depends on the assembly level and proficiency of workers, it is difficult to greatly improve production efficiency

Method used

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  • Micron-level metal wire high-precision automatic micro-assembly device based on micro-pre-tightening force monitoring
  • Micron-level metal wire high-precision automatic micro-assembly device based on micro-pre-tightening force monitoring
  • Micron-level metal wire high-precision automatic micro-assembly device based on micro-pre-tightening force monitoring

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Embodiment Construction

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0035] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The invention provides a micron-level metal wire high-precision automatic micro-assembly device based on micro- pre-tightening force monitoring, which relates to the technical field of automatic micro-assembly and comprises a metal wire micro-assembly on-line detection system, a metal wire micro-assembly operating platform, a micro-wire assembly pre-tightening and micro-force detection system, a micro-wire rapid dispensing system and a visual monitoring system. A columnar wire-to-be-wound micro part is fixed on the metal wire micro-assembly operating platform, the metal wire passes through themicro-wire assembly pre-tightening and micro-force detection system and is connected with the columnar wire-to-be-wound micro part, the metal wire micro-assembly operating platform rotates to wind the metal wire on the columnar wire-to-be-wound micro part, the micro-wire rapid dispensing system is used for gluing the part and has the functions of winding while fixing; the metal wire micro-assembly on-line detection system is used for detecting the position and posture of the columnar wire-to-be-wound micro part in real time; the visual monitoring system is used for automatic operation controland monitoring display; and the device is optimized and compact in structure, and the operation is stable and reliable, and automatic high-standard consistent micro-assembly can be achieved.

Description

technical field [0001] The invention relates to the technical field of automatic micro-assembly, in particular to a micron-level wire high-precision automatic micro-assembly equipment based on micro-pretension monitoring. Background technique [0002] Micro-manipulation technology is a technology that performs certain operations and processing on the whole or part of tiny objects (within the range of 1nm to 1mm). It is an important means to achieve ultra-precision processing, micro-processing, micro-assembly, and large-scale integrated circuit production. [0003] In the prior art, when the assembly of highly flexible fine metal wires is completed, most of them are realized by manual assembly. This assembly technology is relatively backward, and it is difficult to guarantee the assembly accuracy and consistency, and it is difficult to efficiently complete the uniform winding and winding of the wire. It is fixed, and it is easy to cause the filament to break due to uneven ap...

Claims

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Application Information

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IPC IPC(8): F16B11/00
CPCF16B11/006
Inventor 徐振源吴文荣毕列戴曦王红莲杨宏刚张娟魏红彭博温明
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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