Micron-level metal wire high-precision automatic micro-assembly device based on micro-pre-tightening force monitoring

Abstract

The invention provides a micron-level metal wire high-precision automatic micro-assembly device based on micro- pre-tightening force monitoring, which relates to the technical field of automatic micro-assembly and comprises a metal wire micro-assembly on-line detection system, a metal wire micro-assembly operating platform, a micro-wire assembly pre-tightening and micro-force detection system, a micro-wire rapid dispensing system and a visual monitoring system. A columnar wire-to-be-wound micro part is fixed on the metal wire micro-assembly operating platform, the metal wire passes through themicro-wire assembly pre-tightening and micro-force detection system and is connected with the columnar wire-to-be-wound micro part, the metal wire micro-assembly operating platform rotates to wind the metal wire on the columnar wire-to-be-wound micro part, the micro-wire rapid dispensing system is used for gluing the part and has the functions of winding while fixing; the metal wire micro-assembly on-line detection system is used for detecting the position and posture of the columnar wire-to-be-wound micro part in real time; the visual monitoring system is used for automatic operation controland monitoring display; and the device is optimized and compact in structure, and the operation is stable and reliable, and automatic high-standard consistent micro-assembly can be achieved.

Description

technical field [0001] The invention relates to the technical field of automatic micro-assembly, in particular to a micron-level wire high-precision automatic micro-assembly equipment based on micro-pretension monitoring. Background technique [0002] Micro-manipulation technology is a technology that performs certain operations and processing on the whole or part of tiny objects (within the range of 1nm to 1mm). It is an important means to achieve ultra-precision processing, micro-processing, micro-assembly, and large-scale integrated circuit production. [0003] In the prior art, when the assembly of highly flexible fine metal wires is completed, most of them are realized by manual assembly. This assembly technology is relatively backward, and it is difficult to guarantee the assembly accuracy and consistency, and it is difficult to efficiently complete the uniform winding and winding of the wire. It is fixed, and it is easy to cause the filament to break due to uneven ap...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, when the assembly of highly flexible fine metal wires is completed, most of them are realized by manual assembly. This assembly technology is relatively backward, and it is difficult to guarantee the assembly accuracy and consistency, and it is difficult to efficiently complete the uniform winding and winding of the wire. Fixed, and easy to cause filament breakage due to uneven application of external force, assembly efficiency depends on the assembly level and proficiency of workers, it is difficult to greatly improve production efficiency

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