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A kind of automatic wafer transfer method

A transfer method, wafer technology, applied in electrical components, conveyor objects, transportation and packaging, etc., can solve the problems of high brittleness, thin wafer thickness, easy to break and so on

Active Publication Date: 2021-03-05
JIANGSU UNION SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The device can horizontally push the wafer from the first platform to the second platform to transfer the wafer, but its disadvantages are: the thickness of the wafer is relatively thin and brittle, and when the wafer is pushed horizontally, the wafer Unbalanced force is easy to break

Method used

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  • A kind of automatic wafer transfer method
  • A kind of automatic wafer transfer method
  • A kind of automatic wafer transfer method

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0035] Such as Figure 1-18 As shown, it is an automatic wafer transfer device, including a chassis 1, and a waiting platform 2 and a positioning platform 3 are arranged side by side on the chassis 1. It is characterized in that the waiting platform 2 includes a set of transverse transmission boxes 4 and A group of longitudinal frame bars 5 correspondingly arranged on the left and right sides, a wafer magazine 6 is placed between the two transverse transmission boxes 4 and between the two longitudinal frame bars 5, and a number of mutual Parallel wafers 7, the surface of the wafer 7 is parallel to the length direction of the transverse transmission box 4, the upper side and the lower side of the wafer magazine 6 are provided with openings, and the lower side of the wafer magazine 6 is correspondingly provided with a lifting and lifting mechanism, The chassis 1 is provided with a pair of transfer manipulators 8 that can move laterally correspondingly to the wafer magazine 6; th...

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PUM

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Abstract

The invention discloses an automatic wafer transfer method in the field of semiconductor processing. The method comprises the following steps: placing 25 wafers at equidistant intervals in a wafer material box, and then placing the wafer material box in a waiting material box On the platform, place the wafer material frame on the positioning platform; the lifting arm lifts up and passes through the wafer material box, lifts up each wafer, then the lifting arm descends, and the two transfer manipulators move opposite to each other under the wafer On the side, the two supporting arms hold the wafer, and then the two transfer manipulators move towards the positioning platform at the same time, and send the supported wafer to the top of the wafer frame, the lifting arm rises through the wafer frame, and lifts The arm supports each wafer, and then the two transfer manipulators move in reverse, the support arm is separated from the wafer, the lifting arm descends so that each wafer falls into the wafer frame, and the side of the wafer contacts the upper support rod. The invention can transfer the wafers in the wafer material box to the wafer material frame, so as to prevent the wafers from being damaged due to unbalanced force.

Description

technical field [0001] The invention belongs to the field of semiconductor processing, in particular to an automatic wafer transfer method. Background technique [0002] During the process of wafer packaging and testing, wafers need to be frequently transferred or selected. Wafers are usually picked up manually or with a vacuum pen during the process of transferring or picking wafers. Manual handling has the following risks: direct contact with hands may cause product contamination, electrostatic damage, etc., resulting in product defects; improper human actions may cause wafer breakage. There are the following risks in vacuum suction pen picking up wafers: the suction pen and the suction cup directly contact the wafer surface, which is likely to cause scratches; round drop. [0003] In the prior art, there is a wafer transfer tool, its patent application number: CN 201410840504.4; application date: 2014.12.30; publication number: CN 104505361A; publication date: 2015.04....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/677H01L21/673
CPCH01L21/67326H01L21/67766H01L21/67781
Inventor 张鹏吴海波崔福娣
Owner JIANGSU UNION SEMICON